18392809. RESONATOR DEVICE simplified abstract (SEIKO EPSON CORPORATION)
Contents
RESONATOR DEVICE
Organization Name
Inventor(s)
Yukihiro Hashi of Shiojiri-shi (JP)
Junichi Takeuchi of Chino-shi (JP)
Tomoyuki Kamakura of Matsumoto-shi (JP)
RESONATOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18392809 titled 'RESONATOR DEVICE
The resonator device described in the patent application consists of a base substrate, a resonator element, a mounting terminal, and a metal bump.
- The base substrate has two surfaces, with the resonator element located on one side and the mounting terminal on the other.
- The resonator element includes a resonator substrate and an electrode terminal.
- A metal bump is placed between the base substrate and the resonator element to bond them together and electrically connect the mounting terminal and the electrode terminal.
- The cross-sectional area of the metal bump at the bonding portion with the resonator element is crucial, being 491 μm or more and 4007 μm or less.
Potential Applications: - This technology can be used in the manufacturing of resonator devices for various electronic applications. - It can be applied in telecommunications, sensors, and frequency control devices.
Problems Solved: - Ensures a secure bond between the base substrate and the resonator element. - Provides a reliable electrical connection between the mounting terminal and the electrode terminal.
Benefits: - Improved performance and stability of resonator devices. - Enhanced durability and longevity of electronic components.
Commercial Applications: Resonator devices incorporating this technology can be utilized in mobile phones, GPS systems, and other wireless communication devices.
Questions about the technology: 1. How does the metal bump contribute to the overall functionality of the resonator device? 2. What are the key advantages of using this bonding method in comparison to traditional techniques?
Original Abstract Submitted
A resonator device includes: a base substrate having a first surface and a second surface in a front-to-back relationship with the first surface; a resonator element located on a first surface side of the base substrate and including a resonator substrate and an electrode terminal disposed at a base-substrate-side surface of the resonator substrate; a mounting terminal disposed at the first surface; and a metal bump disposed between the base substrate and the resonator element, the metal bump being configured to bond the base substrate and the resonator element and electrically couple the mounting terminal and the electrode terminal. A cross-sectional area of the metal bump at a bonding portion with the resonator element is 491 μmor more and 4007 μmor less.
