18392348. WAFER CLEANING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
WAFER CLEANING APPARATUS
Organization Name
Inventor(s)
Donghoon Kwon of Suwon-si (KR)
WAFER CLEANING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18392348 titled 'WAFER CLEANING APPARATUS
The abstract describes a patent application for a wafer cleaning apparatus with a rotating plate to support the wafer and a cleaning unit above to spray cleaning water.
- The cleaning unit includes a body, a nozzle, at least one supply pipe for a cleaning substance, and a discharge member to release the cleaning water.
- The discharge member has a spraying port in an X shape to spray the cleaning water effectively.
- The apparatus is designed to efficiently clean wafers in a manufacturing process.
Potential Applications:
- Semiconductor manufacturing
- Electronics industry
- Research and development facilities
Problems Solved:
- Efficient cleaning of wafers
- Ensuring high-quality production in semiconductor manufacturing
Benefits:
- Improved cleanliness of wafers
- Enhanced productivity in manufacturing processes
Commercial Applications:
- Wafer fabrication facilities
- Semiconductor manufacturing plants
- Electronics manufacturing companies
Questions about Wafer Cleaning Apparatus: 1. How does the X-shaped spraying port improve the cleaning efficiency?
- The X-shaped spraying port allows for more effective coverage of the wafer surface, ensuring thorough cleaning.
2. What are the potential cost savings associated with using this cleaning apparatus?
- The efficient cleaning process can lead to reduced waste and improved production yield, resulting in cost savings for manufacturing facilities.
Original Abstract Submitted
A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured spray the cleaning water therethrough, and wherein the spraying port has an X shape may be provided.
