18392102. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Toshiyuki Arakane of Miyagi (JP)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18392102 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
The patent application describes a substrate support with a protective member that controls a magnetic field in an outer peripheral portion of the substrate while safeguarding an adhesive layer.
- The substrate support includes a base, an electrostatic chuck on the base with a substrate support surface, an adhesive layer bonding the base to the electrostatic chuck, and a protective member surrounding the adhesive layer.
- The protective member has a main body that shields the adhesive layer and houses a magnetic field generator to control the magnetic field around the substrate.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Wafer bonding technologies
Problems Solved: - Preventing damage to the adhesive layer during magnetic field control - Ensuring stable substrate support during manufacturing processes
Benefits: - Enhanced substrate handling efficiency - Improved product quality in semiconductor fabrication - Extended lifespan of the substrate support system
Commercial Applications: The technology can be utilized in industries such as semiconductor manufacturing, electronics production, and research institutions for advanced material processing.
Questions about the technology: 1. How does the protective member safeguard the adhesive layer during magnetic field control? 2. What are the specific advantages of using a magnetic field generator in the protective member of the substrate support system?
Original Abstract Submitted
A magnetic field in an outer peripheral portion of a substrate is controlled while protecting an adhesive layer of a substrate support. Provided is the substrate support including: a base; an electrostatic chuck provided on the base and having a substrate support surface for supporting a substrate; an adhesive layer provided between the base and the electrostatic chuck and configured to bond the base to the electrostatic chuck; and a protective member including a main body surrounding an outer periphery of the adhesive layer and configured to protect the adhesive layer, and a magnetic field generator provided in the main body and configured to generate a magnetic field in an outer peripheral portion of the substrate and around the substrate.
