18390621. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Chan Hee Nam of Suwon-si (KR)

Oh Hun Gwon of Suwon-si (KR)

Jae Hyun Park of Suwon-si (KR)

Kwan Yeol Paek of Suwon-si (KR)

Chang Geon Lee of Suwon-si (KR)

Hae Suk Chung of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18390621 titled 'MULTILAYER ELECTRONIC COMPONENT

The abstract of this patent application describes a multilayer electronic component with a unique dielectric layer composition and structure.

  • The dielectric layer contains perovskite-based composition represented by AB0, where A includes elements like Bi, Na, K, Sr, and Ca, and B includes Ti.
  • The dielectric layer consists of dielectric grains with a core-shell structure, where the core portion has a higher content of the first element compared to the shell portion.
  • The core portion includes a first core portion and a second core portion with Zr covering part of the first core portion.

Potential Applications: - This technology could be used in the manufacturing of advanced electronic components for various devices. - It may find applications in telecommunications, consumer electronics, and automotive industries.

Problems Solved: - Provides improved dielectric properties for electronic components. - Offers enhanced performance and reliability in electronic devices.

Benefits: - Increased efficiency and stability in electronic components. - Potential for miniaturization and improved functionality in devices.

Commercial Applications: - This technology could be utilized in the production of high-performance capacitors, filters, and sensors for commercial electronics markets.

Questions about the technology: 1. How does the core-shell structure of the dielectric grains contribute to the performance of the electronic component? 2. What are the specific advantages of using a perovskite-based composition in the dielectric layer of electronic components?


Original Abstract Submitted

A multilayer electronic component includes a body including a dielectric layer and internal electrodes; and external electrodes disposed on the body, wherein the dielectric layer includes a plurality of dielectric grains having a perovskite-based composition represented by ABO, the A includes a first element including at least one of Bi, Na, K, Sr, and Ca, and the B includes a second element including Ti, wherein at least one of the plurality of dielectric grains has a core-shell structure, and a content of the first element included in the core portion is twice or more than a content of the first element included in the shell portion, and wherein the core portion includes a first core portion on an internal side and a second core portion covering at least a portion of the first core portion, and the second core portion includes Zr.