18390078. APPARATUS FOR TREATING SUBSTRATE simplified abstract (SEMES CO., LTD.)
Contents
APPARATUS FOR TREATING SUBSTRATE
Organization Name
Inventor(s)
Yoon Seok Choi of Suwon-si (KR)
Yun Sang Kim of Seongnam-si (KR)
Sang Jeong Lee of Hwaseong-si (KR)
Jong Won Park of Yongin-si (KR)
APPARATUS FOR TREATING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18390078 titled 'APPARATUS FOR TREATING SUBSTRATE
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.
- The apparatus is designed to treat substrates within a chamber.
- A support unit holds the substrate in place within the treating space.
- A window plate is positioned above the treating space.
- A conductive layer is applied to the top surface of the window plate.
- The conductive layer allows for efficient treatment of the substrate.
Potential Applications: This technology could be used in semiconductor manufacturing processes, thin film deposition, and other industries requiring precise substrate treatment.
Problems Solved: This apparatus solves the problem of ensuring uniform treatment of substrates by providing a conductive layer on the window plate.
Benefits: The benefits of this technology include improved substrate treatment efficiency, enhanced uniformity, and potentially higher quality end products.
Commercial Applications: This technology could be valuable in the semiconductor industry, electronics manufacturing, and research institutions focusing on thin film deposition processes.
Questions about Substrate Treating Apparatus: 1. How does the conductive layer on the window plate improve substrate treatment efficiency? 2. What are the potential applications of this technology beyond semiconductor manufacturing?
Original Abstract Submitted
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; a support unit configured to support a substrate in the treating space; a window plate positioned above the treating space; and a conductive layer formed on the window plate, and wherein a bottom surface of the window plate is exposed to the treating space, and the conductive layer is formed on a top surface among a top surface and a bottom surface of the window plate.
