18389775. WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF simplified abstract (NICHIA CORPORATION)

WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF

Organization Name

NICHIA CORPORATION

Inventor(s)

Atsushi Hosokawa of Tokushima-shi (JP)

Masaaki Katsumata of Anan-shi (JP)

Eiko Minato of Anan-shi (JP)

WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18389775 titled 'WIRING SUBSTRATE, LIGHT-EMITTING DEVICE, AND MANUFACTURING METHODS THEREOF

The abstract describes a wiring substrate with a base body, a conductive portion in a via hole, and a wiring portion connected to the conductive portion on the body's surface. The conductive portion contains a first conductive member with copper particles and resin, including small and large-sized particles. The wiring portion contains a second conductive member with copper particles of similar sizes. The first member has a lower proportion of small-sized particles compared to the second member.

• The wiring substrate includes a base body, a conductive portion, and a wiring portion.
• The conductive portion contains a first member with copper particles and resin, including small and large-sized particles.
• The wiring portion contains a second member with copper particles of similar sizes.
• The first member has a lower proportion of small-sized particles compared to the second member.

1. 1. 1. Potential Applications

This technology can be used in various electronic devices and circuits where a reliable and efficient wiring substrate is required.

1. 1. 1. Problems Solved

This technology addresses the need for a wiring substrate with improved conductivity and reliability in electronic applications.

1. 1. 1. Benefits

- Enhanced conductivity due to the presence of copper particles - Improved reliability in electronic circuits - Cost-effective manufacturing process

1. 1. 1. Commercial Applications

This technology can be applied in the manufacturing of printed circuit boards, electronic components, and other electrical devices, catering to industries such as consumer electronics, telecommunications, and automotive.

1. 1. 1. Questions about the Technology
         1. 1. How does the presence of copper particles enhance the conductivity of the wiring substrate?

Copper particles in the conductive portion improve the substrate's conductivity by providing a path for the flow of electrical current.

1. 1. 1. 1. 2. What advantages does the use of small and large-sized particles in the conductive portion offer in terms of performance and reliability?

The combination of small and large-sized particles in the conductive portion ensures a more uniform distribution of copper throughout the substrate, enhancing its performance and reliability.

Original Abstract Submitted

A wiring substrate including a base body provided with a via hole, a conductive portion disposed in the via hole, and a wiring portion electrically connected to the conductive portion and disposed on a surface of the body. The conductive portion includes a first conductive member containing copper particles and a resin. The first member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. The wiring portion includes a second conductive member containing copper particles. The second member contains small-sized particles with a particle size from 0.1 μm to 1.0 μm and large-sized particles with a particle size from more than 1.0 μm to 10 μm. A weight proportion of the small-sized particles in the first member is lower than a weight proportion of the small-sized particles in the second member.