18389614. DEBONDING REPAIR DEVICES simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
Contents
DEBONDING REPAIR DEVICES
Organization Name
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Inventor(s)
Guilian Gao of Campbell CA (US)
Laura Wills Mirkarimi of Sunol CA (US)
Gabriel Z. Guevara of Gilroy CA (US)
Thomas Workman of San Jose CA (US)
Dominik Suwito of San Jose CA (US)
DEBONDING REPAIR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18389614 titled 'DEBONDING REPAIR DEVICES
Simplified Explanation: The patent application describes a method for repairing a bonded structure by debonding a semiconductor element from a carrier, cleaning the bonding site, and bonding a new semiconductor element to the carrier.
Key Features and Innovation:
- Debonding and cleaning process to prepare for bonding a new semiconductor element.
- Direct bonding of the new semiconductor element to the carrier.
- Surface modification to reduce dielectric bond energy.
- Use of fluid delivery and temperature adjustment pad for debonding.
Potential Applications: This technology can be applied in the semiconductor industry for repairing bonded structures in electronic devices, such as integrated circuits and microchips.
Problems Solved: This technology addresses the need for efficient repair methods for bonded structures in semiconductor devices without causing damage to the components.
Benefits:
- Cost-effective repair solution for bonded structures.
- Improved reliability and performance of repaired semiconductor devices.
- Extended lifespan of electronic components through effective repair techniques.
Commercial Applications: Repairing bonded structures in semiconductor devices can have significant commercial applications in the electronics industry, leading to cost savings in manufacturing and maintenance processes.
Prior Art: Readers can explore prior art related to semiconductor bonding techniques, surface modification methods, and repair processes in the semiconductor industry.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor repair technologies, surface modification techniques, and bonding methods for electronic devices.
Questions about Semiconductor Bonding: 1. What are the key challenges in repairing bonded structures in semiconductor devices? 2. How does surface modification help in reducing dielectric bond energy in semiconductor bonding processes?
Original Abstract Submitted
A method of repairing a bonded structure is disclosed. The method can include debonding from a carrier a first semiconductor element that is bonded to a bonding site of the carrier, cleaning the bonding site of the carrier; and bonding a second semiconductor element to the bonding site of the carrier. The bonding can also include directly bonding the second semiconductor element and the carrier. The method can further include reducing the dielectric bond energy via a surface modification between the first semiconductor element and the carrier. Debonding the bonded structure can include delivering a fluid from one or more nozzles to a bonding interface between the first semiconductor element and the carrier to reduce the bond energy. A temperature adjustment pad can also be included to debond the bonded structure.
