18388563. QUANTUM DEVICE simplified abstract (NEC Corporation)
Contents
- 1 QUANTUM DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 QUANTUM DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
QUANTUM DEVICE
Organization Name
Inventor(s)
QUANTUM DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18388563 titled 'QUANTUM DEVICE
Simplified Explanation
The abstract of the patent application describes a quantum device consisting of two chips assembled to create a three-dimensional wiring structure. The first chip has a protruding region with terminals on it, extending from the outer periphery of the second chip.
- The quantum device includes two chips assembled to form a three-dimensional wiring structure.
- The first chip has a protruding region with terminals, extending from the outer periphery of the second chip.
Potential Applications
This technology could be applied in quantum computing, telecommunications, and advanced electronics.
Problems Solved
This innovation solves the problem of complex wiring structures in quantum devices, enabling more efficient and compact designs.
Benefits
The benefits of this technology include improved performance, increased reliability, and enhanced scalability in quantum devices.
Potential Commercial Applications
The potential commercial applications of this technology include quantum computing systems, high-speed data processing units, and advanced communication devices.
Possible Prior Art
One possible prior art for this technology could be the use of stacked chips in semiconductor devices to increase functionality and performance.
Unanswered Questions
How does this technology impact the overall size of quantum devices?
The abstract does not provide information on whether this innovation reduces the size of quantum devices or if it has any impact on their overall dimensions.
What materials are used in the construction of the chips for this quantum device?
The abstract does not specify the materials used in the construction of the chips, which could be crucial for understanding the performance and durability of the device.
Original Abstract Submitted
A quantum device includes a first chip and a second chip that are assembled to configure a three-dimensional wiring structure. The first chip includes a protruding region protruded from a side edge of an outer periphery of the second chip and includes terminals on the protruding region.
