18388140. Beam-Tilting Light Source Enclosures simplified abstract (Apple Inc.)
Contents
Beam-Tilting Light Source Enclosures
Organization Name
Inventor(s)
Michael K. Mccord of San Francisco CA (US)
Mehmet Mutlu of Grover Beach CA (US)
Ryan J. Linderman of Oakland CA (US)
Beam-Tilting Light Source Enclosures - A simplified explanation of the abstract
This abstract first appeared for US patent application 18388140 titled 'Beam-Tilting Light Source Enclosures
Simplified Explanation
The abstract describes an optical module with a beam-tilting light source enclosure that can be coupled to a substrate and an electronic device component.
- The enclosure has a first surface that attaches flat to the substrate and a second surface that is tilted and attaches flat to the electronic device component.
- The enclosure is transparent and covers the light source when connected to the substrate.
- Assembly involves attaching the first surface to the substrate and the second surface to the electronic device component.
Potential Applications
- Optical communication systems
- Automotive lighting systems
- Medical imaging devices
Problems Solved
- Efficient light projection
- Secure attachment of light source enclosure
- Optimal light transmission
Benefits
- Improved light projection accuracy
- Simplified assembly process
- Enhanced optical performance
Original Abstract Submitted
An optical module includes a beam-tilting light source enclosure. The enclosure is coupled to a substrate that includes a light emitter connected thereto. The enclosure has a geometry such that the enclosure has a first surface configured to couple substantially flat to the substrate and a second surface tilted with respect to the first surface and configured to couple substantially flat to a component of an electronic device through which the light is to project. The enclosure is optically transmissive and covers the light source when coupled to the substrate. In this way, the enclosure may be assembled and used in the electronic device by coupling the first surface to the substrate and coupling the second surface to the component.
