18387659. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

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MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Sung Yong Kang of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18387659 titled 'MULTILAYER ELECTRONIC COMPONENT

The abstract of the patent application describes a multilayer electronic component with specific compositions in different parts of the component.

  • The component includes a body with a capacitance forming portion, internal electrodes, external electrodes, and side margin portions.
  • The Ba/Ti molar ratio in the side margin portion is between 1.025 and 1.035, higher than in the capacitance forming portion.
  • The side margin portion contains a specific amount of Mg and Sn based on 100 moles of Ti.
  • The number of moles of Mg is between 1.0 and 2.0, while the number of moles of Sn is between 0.01 and 5.0.

Potential Applications: - This technology can be used in various electronic devices requiring multilayer electronic components. - It can be applied in telecommunications, consumer electronics, automotive systems, and more.

Problems Solved: - Provides improved performance and stability in electronic components. - Enhances the reliability and longevity of electronic devices.

Benefits: - Higher efficiency and functionality of electronic components. - Increased durability and resistance to environmental factors. - Cost-effective production process.

Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Performance This technology can be utilized in the manufacturing of various electronic devices, leading to improved performance and reliability. The market implications include increased demand for high-quality electronic components in industries such as telecommunications, automotive, and consumer electronics.

Questions about Multilayer Electronic Components: 1. How does the specific composition of the side margin portion contribute to the overall performance of the electronic component? The specific composition of the side margin portion, including the Ba/Ti molar ratio and the presence of Mg and Sn, enhances the stability and reliability of the component by improving its electrical properties and resistance to external factors.

2. What are the potential challenges in implementing this technology in mass production? Implementing this technology in mass production may require adjustments to manufacturing processes and quality control measures to ensure consistency in the composition of the electronic components. Additionally, sourcing the necessary materials in large quantities could be a logistical challenge.


Original Abstract Submitted

A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and internal electrodes, and first to sixth surfaces; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively, wherein a Ba/Ti molar ratio of the side margin portion satisfies greater than 1.025 and less than 1.035, and is higher than a Ba/Ti molar ratio of the capacitance forming portion, wherein the number of moles of Mg based on 100 moles of Ti included in the side margin portion is greater than 1.0 mole and less than 2.0 moles, and wherein the number of moles of Sn based on 100 moles of Ti included in the side margin portion is 0.01 moles or more and less than 5.0 moles.

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