18387276. WIDEBAND ANTENNAAND ANTENNA MODULE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
WIDEBAND ANTENNAAND ANTENNA MODULE INCLUDING THE SAME
Organization Name
Inventor(s)
Sunwoo Lee of Suncheon-si (KR)
Dooseok Choi of Hwaseong-si (KR)
Seungchan Heo of Yongin-si (KR)
WIDEBAND ANTENNAAND ANTENNA MODULE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18387276 titled 'WIDEBAND ANTENNAAND ANTENNA MODULE INCLUDING THE SAME
Simplified Explanation
The antenna module described in the patent application includes a first patch antenna and an electromagnetic band gap (EBG) structure.
- The antenna module consists of multiple conductive layers stacked in a specific direction.
- The first patch antenna contains at least one radiator within a conductive layer.
- The EBG structure comprises pillars positioned around the radiator, with each pillar consisting of two or more plates in parallel within different conductive layers, connected by at least one via.
Potential Applications:
- Wireless communication systems
- Radar systems
- Satellite communication systems
Problems Solved:
- Improved antenna performance
- Reduction of interference and noise
- Enhanced signal quality and coverage
Benefits:
- Increased antenna efficiency
- Enhanced signal reception and transmission
- Better overall performance in communication systems
Original Abstract Submitted
Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
