18385909. METHOD FOR MONITORING PERFORMANCE OF ECCENTRICITY CORRECTION UNIT AND SUBSTRATE TREATING APPARATUS FOR PERFORMING METHOD simplified abstract (SEMES CO., LTD.)

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METHOD FOR MONITORING PERFORMANCE OF ECCENTRICITY CORRECTION UNIT AND SUBSTRATE TREATING APPARATUS FOR PERFORMING METHOD

Organization Name

SEMES CO., LTD.

Inventor(s)

In Ki Jung of Gyeonggi-do (KR)

Jeong Hyup Yu of Gyeonggi-do (KR)

Young Joon Han of Chungcheongnam-do (KR)

Sung Bum Park of Chungcheongnam-do (KR)

METHOD FOR MONITORING PERFORMANCE OF ECCENTRICITY CORRECTION UNIT AND SUBSTRATE TREATING APPARATUS FOR PERFORMING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18385909 titled 'METHOD FOR MONITORING PERFORMANCE OF ECCENTRICITY CORRECTION UNIT AND SUBSTRATE TREATING APPARATUS FOR PERFORMING METHOD

Simplified Explanation

The patent application describes a method for monitoring the performance of an eccentricity correction unit used in industrial processes. The method involves measuring the eccentricity of a substrate and monitoring the correction unit's performance based on the stored correction data.

Key Features and Innovation

  • Method for measuring and storing eccentricity correction data
  • Monitoring performance degradation of the eccentricity correction unit
  • Ensuring substrate eccentricity is within allowable values

Potential Applications

This technology can be applied in various industrial processes where precise alignment and correction of substrates are crucial, such as printing, coating, and semiconductor manufacturing.

Problems Solved

  • Ensures substrates are within allowable eccentricity values
  • Monitors and detects performance degradation of the correction unit
  • Improves overall quality and efficiency of industrial processes

Benefits

  • Enhanced accuracy in substrate alignment
  • Prevents defects and errors in manufacturing processes
  • Increases productivity and reduces downtime

Commercial Applications

  • Printing industry for precise alignment of printing substrates
  • Semiconductor manufacturing for accurate positioning of wafers
  • Coating industry for uniform coating application

Prior Art

Prior art related to this technology may include patents or research papers on eccentricity correction methods in industrial processes, as well as monitoring systems for industrial equipment performance.

Frequently Updated Research

Researchers may be exploring advancements in eccentricity correction algorithms, real-time monitoring systems for industrial equipment, and automated correction methods for substrate alignment.

Questions about Eccentricity Correction Monitoring

How does this method improve industrial processes?

This method ensures precise alignment of substrates, leading to improved product quality and reduced errors in manufacturing.

What are the potential challenges in implementing this technology?

Challenges may include integrating the monitoring system with existing equipment and ensuring accurate calibration of the correction unit.


Original Abstract Submitted

A method for monitoring performance of an eccentricity correction unit, the method includes a first operation of measuring eccentricity of a substrate mounted on a support unit and storing an amount of eccentricity correction corrected by the eccentricity correction unit such that measured eccentricity of the substrate is within a preset allowable eccentricity value, and a second operation of monitoring, based on the stored amount of eccentricity correction, performance degradation of the eccentricity correction unit.