18384796. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Byung Jun Jeon of Suwon-si (KR)
Chae Min Park of Suwon-si (KR)
Hyung Duk Yun of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18384796 titled 'MULTILAYER ELECTRONIC COMPONENT
The abstract describes a multilayer electronic component with external electrodes connected to internal electrodes through base plating layers and electrode layers made of conductive metal and glass. The base plating layers contain Ni grains with a grain size of 4 μm or greater.
- The electronic component has a complex structure with multiple layers for efficient functioning.
- The use of conductive metal and glass in the electrode layers ensures good conductivity and durability.
- The presence of Ni grains in the base plating layers enhances the component's performance.
- The grain size of 4 μm or greater in the Ni grains contributes to the component's reliability and stability.
- The design of the component aims to improve overall electronic device performance and longevity.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Enhances conductivity and durability of electronic components. - Improves overall performance and reliability of electronic devices.
Benefits: - Increased efficiency and longevity of electronic components. - Enhanced performance and stability of electronic devices.
Commercial Applications: Title: Advanced Multilayer Electronic Component Technology for Enhanced Device Performance This technology can be utilized by electronic manufacturers to improve the quality and reliability of their products, leading to increased customer satisfaction and market competitiveness.
Questions about Multilayer Electronic Component Technology: 1. How does the presence of Ni grains in the base plating layers impact the performance of the electronic component? - The Ni grains enhance the reliability and stability of the component by providing a strong foundation for the electrodes. 2. What are the main advantages of using a multilayer electronic component in electronic devices? - Multilayer electronic components offer improved conductivity, durability, and overall performance in electronic devices.
Original Abstract Submitted
A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 μm×5 μm region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 μm or greater.
