18384709. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Yang Liu of Suzhou Industrial Park (CN)
Zhenrong Yang of Suzhou Industrial Park (CN)
PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18384709 titled 'PRINTED CIRCUIT BOARD
The abstract of the patent application describes a printed circuit board divided into a printed circuit board area and a peripheral area, with unit printed circuit boards in the former and a base portion in the latter. The base portion includes circuit pattern and insulating material portions, along with first and second solder resist portions on its surfaces.
- The patent application features a printed circuit board with unit printed circuit boards in a designated area and a base portion in the surrounding peripheral area.
- The base portion includes circuit pattern and insulating material portions, providing structural support and electrical connectivity.
- Two solder resist portions, one in the peripheral area and one in the printed circuit board area, enhance the board's durability and protect against solder bridging.
- The first solder resist portion contains a first filler, while the second solder resist portion contains a different second filler, ensuring specific material properties in each area.
- This design allows for efficient assembly and maintenance of electronic components on the printed circuit board.
Potential Applications: This technology can be applied in various electronic devices such as smartphones, computers, and automotive systems where compact and reliable circuit boards are essential.
Problems Solved: The innovation addresses the need for improved solder resist materials and efficient layout designs in printed circuit boards to enhance performance and reliability.
Benefits: - Enhanced durability and protection against solder bridging - Efficient assembly and maintenance of electronic components - Improved overall performance and reliability of electronic devices
Commercial Applications: This technology can be utilized in the manufacturing of consumer electronics, automotive systems, industrial equipment, and telecommunications devices to improve circuit board performance and reliability.
Questions about the technology: 1. How does the use of different fillers in the solder resist portions benefit the overall performance of the printed circuit board? 2. What specific challenges in electronic device manufacturing does this technology help to address?
Original Abstract Submitted
A printed circuit board, divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area, includes: a plurality of unit printed circuit boards provided in the printed circuit board area; a base portion provided in the peripheral area and the printed circuit board area, and including a circuit pattern portion and an insulating material portion; a first solder resist portion provided in the peripheral area on a first surface of the base portion and a second surface of the base portion, the first surface being opposite to the second surface; and a second solder resist portion provided in the printed circuit board area on the first surface of the base portion and the second surface of the base portion. The first solder resist portion surrounds the second solder resist portion in the printed circuit board area. The first solder resist portion includes a first filler and the second solder resist portion includes a second filler that is different from the first filler.
