18384368. DISPLAY PANEL simplified abstract (SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
Contents
DISPLAY PANEL
Organization Name
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Inventor(s)
DISPLAY PANEL - A simplified explanation of the abstract
This abstract first appeared for US patent application 18384368 titled 'DISPLAY PANEL
The embodiment of the present application provides a display panel with a driver substrate and a light emitting device bonded to it. The driver substrate includes a driver circuit and a first power line with a conductive pad. The light emitting device has a first soldering pad overlapping and bonded to the conductive pad, and a second soldering pad electrically connected to the driver circuit. By overlapping and bonding the first soldering pad to the first power line, the overlapping area is increased, enhancing the connection.
- The display panel includes a driver substrate and a light emitting device.
- The driver substrate has a driver circuit and a first power line with a conductive pad.
- The light emitting device has a first soldering pad and a second soldering pad.
- The first soldering pad overlaps and bonds to the conductive pad on the driver substrate.
- The second soldering pad is electrically connected to the driver circuit.
Potential Applications: - This technology can be used in various display panels, such as LCD screens or LED displays. - It can also be applied in electronic devices requiring efficient power distribution and connection.
Problems Solved: - Enhances the connection between the driver substrate and the light emitting device. - Increases the overlapping area for a more secure bond.
Benefits: - Improved reliability and stability of the display panel. - Enhanced electrical connection for better performance.
Commercial Applications: Title: Enhanced Display Panel Technology for Electronics Industry This technology can be utilized in manufacturing companies producing electronic devices with display panels, improving the overall quality and performance of their products.
Questions about Enhanced Display Panel Technology: 1. How does the increased overlapping area between the soldering pad and power line benefit the display panel's performance? - The increased overlapping area ensures a more secure bond and enhances the electrical connection, leading to improved reliability and stability of the display panel.
2. What are the potential market implications of implementing this technology in electronic devices? - By incorporating this technology, manufacturers can enhance the quality and performance of their products, potentially increasing customer satisfaction and market competitiveness.
Original Abstract Submitted
The embodiment of the present application provides a display panel. The display panel includes a driver substrate and a light emitting device bonded to and disposed on the driver substrate. The driver substrate includes a driver circuit and a first power line. The first power line includes a conductive pad. The light emitting device includes a first soldering pad and a second soldering pad. The first soldering pad overlaps and is bonded to the conductive pad. The second soldering pad is electrically connected to the driver circuit. The embodiment of the present application overlaps and bonds the opaque first soldering pad to the first power line, particularly overlaps and bonds the first soldering pad to the conductive pad. Therefore, an overlapping area between the first soldering pad and the first power line is increased.
