18384152. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 FAN-OUT SEMICONDUCTOR PACKAGE
FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18384152 titled 'FAN-OUT SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a unique connection structure with multiple via arrays and pads to enhance electrical connections within the package.
- The connection structure consists of a first via array with multiple vias in a first direction, a second via array above the first via array with vias also in the first direction, and a first pad located between the two via arrays on the upper surfaces of the first vias.
- The second via array is offset from the first via array in the first direction and does not overlap the first via array vertically, allowing for efficient routing of electrical connections within the semiconductor package.
Potential Applications
The technology described in this patent application could be applied in various semiconductor devices and electronic components where efficient and reliable electrical connections are crucial.
Problems Solved
This innovation solves the problem of optimizing the layout of via arrays and pads in a semiconductor package to improve electrical connections and signal transmission without interference or overlap.
Benefits
The benefits of this technology include enhanced electrical performance, increased reliability, and potentially reduced signal interference within semiconductor packages.
Potential Commercial Applications
This technology could find applications in the manufacturing of integrated circuits, microprocessors, memory modules, and other semiconductor devices where precise electrical connections are essential for performance.
Possible Prior Art
One possible prior art in this field could be the use of similar via arrays and pads in semiconductor packages to improve electrical connections and signal transmission. However, the specific configuration and offset design described in this patent application may be a novel approach to addressing these challenges.
Unanswered Questions
How does this technology compare to existing methods of optimizing via arrays and pads in semiconductor packages?
This article does not provide a direct comparison to existing methods or technologies in the field, leaving room for further analysis on the effectiveness and efficiency of this innovation.
What are the potential limitations or drawbacks of implementing this unique connection structure in semiconductor packages?
The article does not address any potential limitations or drawbacks that may arise from using this specific configuration of via arrays and pads, leaving room for further exploration of possible challenges in practical applications.
Original Abstract Submitted
Provided is a semiconductor package including a semiconductor chip, a connection structure below the semiconductor chip and electrically connected to the semiconductor chip, and an external connection terminal below the connection structure, wherein the connection structure includes a first via array including a plurality of first vias in a first direction, a second via array above the first via array and including a plurality of second vias in the first direction, and a first pad between the first via array and the second via array and on upper surfaces of the plurality of the first vias, wherein the second via array is offset from the first via array in the first direction and does not overlap the first via array in a vertical direction.
