18382321. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
- 1 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Circuit Board Design
- 1.13 Original Abstract Submitted
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18382321 titled 'CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
Simplified Explanation
The disclosed circuit board includes an insulating layer, a contact layer, a connecting layer with a connecting portion embedded in the insulating layer, a via connecting the connecting layer, and a wiring layer. The connecting portion consists of a first connecting layer portion on the contact layer and a second connecting layer portion on the first connecting layer portion. The insulating layer has a first portion embedding the first connecting layer portion and a second portion embedding the second connecting layer portion, with a cavity penetrating the second portion. The first portion is smaller in area than the second portion.
Key Features and Innovation
- Circuit board design with insulating, contact, connecting, and wiring layers.
- Unique connecting layer structure with two connecting layer portions.
- Insulating layer configuration with distinct first and second portions.
- Cavity in the insulating layer for specific functionality.
Potential Applications
The circuit board design can be used in various electronic devices requiring complex connections and wiring.
Problems Solved
This technology addresses the need for efficient and reliable circuit board designs with intricate connections.
Benefits
- Enhanced connectivity and reliability in electronic devices.
- Improved efficiency in circuit board manufacturing processes.
Commercial Applications
- Electronics manufacturing industry for producing high-quality circuit boards.
- Consumer electronics market for devices requiring advanced circuitry.
Prior Art
Readers can explore prior art related to circuit board design, connecting layers, and insulating layer configurations in electronic devices.
Frequently Updated Research
Stay updated on the latest research in circuit board design, insulating layer materials, and advanced connectivity solutions.
Questions about Circuit Board Design
What are the key components of a circuit board?
A circuit board typically consists of insulating layers, contact layers, connecting layers, and wiring layers to facilitate electronic connections and functionality.
How does the connecting layer structure impact circuit board performance?
The connecting layer structure, including multiple connecting layer portions, can enhance connectivity and reliability in electronic devices.
Original Abstract Submitted
A disclosed circuit board includes: an insulating layer; a contact layer disposed on a first surface of the insulating layer; a connecting layer including a connecting portion embedded in the insulating layer and disposed on the contact layer; a via penetrating the insulating layer and connected to the connecting layer; and a wiring layer disposed on a second surface of the insulating layer opposing the first surface and connected to the via. The connecting portion includes a first connecting layer portion disposed on the contact layer and a second connecting layer portion disposed on the first connecting layer portion. The insulating layer includes a first portion embedding the first connecting layer portion and surrounding the first connecting layer portion and a second portion embedding the second connecting layer portion. The insulating layer includes a cavity penetrating the second portion. The first portion has a smaller area than the second portion.
