18382239. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (SEMES CO., LTD.)
Contents
- 1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Organization Name
Inventor(s)
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18382239 titled 'SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Simplified Explanation
The substrate processing apparatus described in the abstract consists of multiple process chambers, two transfer robots, and a share module. The transfer robots are located in separate transfer chambers and are capable of transferring the substrate in a vacuum state. The share module is positioned adjacent to the transfer chambers and can receive the substrate from either transfer robot.
- The substrate processing apparatus includes:
- Multiple process chambers for processing a substrate
- Two transfer robots located in separate transfer chambers
- A share module adjacent to the transfer chambers for receiving the substrate
- Transfer of the substrate in a vacuum state by the transfer robots
Potential Applications
The technology described in this patent application could be applied in semiconductor manufacturing, thin film deposition, and other industries requiring precise substrate processing in a vacuum environment.
Problems Solved
This technology solves the problem of contamination during substrate transfer by ensuring that the transfer robots operate in a vacuum state, preventing any foreign particles from affecting the substrate.
Benefits
The benefits of this technology include improved substrate processing quality, increased efficiency in transferring substrates between chambers, and reduced risk of contamination, leading to higher yields in manufacturing processes.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of advanced electronic devices, where precise substrate processing is crucial for achieving high performance and reliability.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus with transfer robots, but the innovation in this patent application lies in the specific configuration of the transfer robots in separate chambers and the share module for receiving the substrate.
Unanswered Questions
The abstract does not provide details on the mechanism or criteria used by the share module to select the transfer robot for substrate transfer.
The abstract does not mention the limitations or specifications of the share module in terms of the size and weight of substrates it can handle.
Original Abstract Submitted
A substrate processing apparatus includes a plurality of process chambers for processing a substrate, a first transfer robot configured to transfer the substrate and arranged in a first transfer chamber, a second transfer robot configured to transfer the substrate and arranged in a second transfer chamber, and a share module arranged adjacent to the first transfer chamber and the second transfer chamber and configured to receive the substrate from any one of the first transfer robot and the second transfer robot, wherein an inside of each of the first transfer chamber and the second transfer chamber is in a vacuum state, and the first transfer robot and the second transfer robot transfer the substrate in a vacuum state.
