18382202. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

PRINTED CIRCUIT BOARD

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Ki Ran Park of Suwon-si (KR)

Hyun Woo Kwon of Suwon-si (KR)

Tae Hong Min of Suwon-si (KR)

Sang Hyun Han of Suwon-si (KR)

Guh Hwan Lim of Suwon-si (KR)

Yo Han Song of Suwon-si (KR)

Dong Keun Lee of Suwon-si (KR)

Kyeong Yub Jung of Suwon-si (KR)

Eun Gyu Jeong of Suwon-si (KR)

Yu Mi Kim of Suwon-si (KR)

PRINTED CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18382202 titled 'PRINTED CIRCUIT BOARD

The abstract describes a printed circuit board with multiple layers and a via structure for electrical connections.

• The circuit board includes a first insulating layer.
• A via pad is located on the upper surface of the first insulating layer.
• A second insulating layer is placed on top of the first insulating layer, with a via hole exposing part of the via pad.
• A conductor pattern is positioned on the exposed upper surface of the via pad.
• A via is present, consisting of a first metal layer covering the walls of the via hole, the exposed upper surface of the via pad, and the conductor pattern, along with a second metal layer within the via hole.

Potential Applications: - This technology can be used in various electronic devices such as smartphones, laptops, and IoT devices. - It can also be applied in industrial equipment, automotive systems, and aerospace technology.

Problems Solved: - Provides a reliable and efficient method for creating electrical connections in complex circuit boards. - Enhances the overall performance and durability of electronic devices.

Benefits: - Improved signal transmission and reduced signal loss. - Increased reliability and longevity of electronic components. - Cost-effective manufacturing process for high-density circuit boards.

Commercial Applications: Title: Advanced Circuit Board Technology for Enhanced Electronic Devices This technology can be utilized in the production of consumer electronics, telecommunications equipment, and medical devices. The market implications include improved product performance, reduced maintenance costs, and increased customer satisfaction.

Questions about the technology: 1. How does this technology compare to traditional methods of creating circuit boards? - This technology offers enhanced reliability and performance compared to traditional methods by providing more efficient electrical connections and improved signal transmission. 2. What are the potential cost savings associated with implementing this advanced circuit board technology? - The use of this technology can lead to cost savings in manufacturing processes, reduced maintenance costs, and increased product longevity.

Original Abstract Submitted

A printed circuit board includes: a first insulating layer; a via pad disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a via hole exposing at least a portion of an upper surface of the via pad; a conductor pattern disposed on the exposed upper surface of the via pad; and a via including a first metal layer covering at least a portion of each of a wall surface of the via hole, the exposed upper surface of the via pad, and the conductor pattern, and a second metal layer disposed on the first metal layer and disposed in at least a portion of the via hole.