18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Junhyeong Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18381905 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The method described in the abstract involves manufacturing a semiconductor package by forming a first wiring structure, coating it with a high transmittance photoresist multiple times, creating openings by exposing and developing the photoresist, filling these openings with conductive material to form conductive posts, placing a semiconductor chip on the structure, encapsulating the chip and conductive posts, and forming a second wiring structure on top.
- Formation of a semiconductor package involves multiple steps including coating with high transmittance photoresist, creating openings, filling with conductive material, and encapsulating the chip.
- The high transmittance photoresist must have a light transmittance of at least 3.2% where it contacts the first wiring structure.
- This method allows for the creation of a semiconductor package with improved light transmittance properties.
- The use of high transmittance photoresist enhances the performance and functionality of the semiconductor package.
- The process described in the patent application aims to optimize the manufacturing of semiconductor packages for various applications.
Potential Applications: - Semiconductor industry for manufacturing advanced packages - Electronics industry for high-performance devices - Telecommunications for improved signal transmission - Automotive sector for enhanced electronic components
Problems Solved: - Enhancing light transmittance in semiconductor packages - Improving overall performance and functionality of electronic devices - Optimizing manufacturing processes for semiconductor packages
Benefits: - Increased light transmittance for better performance - Enhanced functionality of semiconductor packages - Improved manufacturing efficiency and quality control
Commercial Applications: Title: Advanced Semiconductor Package Manufacturing Process This technology can be used in the semiconductor industry to produce high-performance packages for various electronic devices. The optimized manufacturing process can lead to improved functionality and efficiency in electronic components, catering to a wide range of commercial applications.
Questions about Semiconductor Package Manufacturing: 1. How does the use of high transmittance photoresist impact the performance of semiconductor packages? 2. What are the potential advantages of optimizing the manufacturing process for semiconductor packages?
Original Abstract Submitted
Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, coating a high transmittance photoresist on the first wiring structure a plurality of number of times, forming a plurality of openings by exposing and developing the high transmittance photoresist, forming a plurality of conductive posts by filling the plurality of openings with a conductive material, removing the high transmittance photoresist, disposing a semiconductor chip on the first wiring structure, forming an encapsulant surrounding the semiconductor chip and the plurality of conductive posts, and forming a second wiring structure on the encapsulant, wherein the light transmittance of the high transmittance photoresist at a portion where the first wiring structure and the high transmittance photoresist contact each other is greater than or equal to 3.2%.
