18380937. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
HSIH-YANG Chiu of TAOYUAN CITY (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380937 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The semiconductor device described in the patent application includes an interposer, a conductive via, an insulation layer, and a first electronic component. The interposer has two surfaces, with the conductive via extending between them and the insulation layer separating the via from the interposer. The first electronic component is placed on one of the surfaces and connected to the conductive via.
- The semiconductor device includes an interposer, conductive via, insulation layer, and electronic component.
- The interposer has two surfaces, with the conductive via extending between them.
- The insulation layer separates the conductive via from the interposer.
- The first electronic component is placed on one of the surfaces and connected to the conductive via.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a compact and efficient way to connect electronic components in a semiconductor device. - Ensures reliable electrical connections between components.
Benefits: - Improved performance and reliability of electronic devices. - Cost-effective manufacturing process for semiconductor devices.
Commercial Applications: Title: Semiconductor Device Technology for Enhanced Electronic Connections This technology can be utilized in the consumer electronics industry, automotive sector, medical device manufacturing, and industrial automation.
Questions about Semiconductor Device Technology: 1. How does this technology improve the efficiency of electronic devices? 2. What are the potential cost savings associated with using this semiconductor device technology?
Original Abstract Submitted
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes an interposer, a conductive via, an insulation layer, and a first electronic component. The interposer has a first surface and a second surface opposite to the first surface. The conductive via extends between the first surface and the second surface of the interposer. The insulation layer separates the conductive via from the interposer. The first electronic component is disposed on the second surface and electrically connected to the conductive via.
