18380928. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380928 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a semiconductor chip with a substrate, chip pad, support pad, support bump, wiring substrate, support BOT pad, and a dummy area.
- The semiconductor chip has a substrate with a first and second surface, a chip pad with a conductive layer, and a support pad with an insulating layer.
- A support bump is connected to the support pad, and a wiring substrate faces the semiconductor substrate.
- A support BOT pad on the wiring substrate is bonded to the support bump, and a dummy area is spaced apart from the support BOT pad.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a reliable and efficient way to package semiconductor chips. - Ensures proper electrical connections and thermal management.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced durability and longevity of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the consumer electronics industry to improve the functionality and longevity of electronic devices. It can also benefit manufacturers of automotive electronics, medical devices, and industrial equipment by providing a more reliable packaging solution.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology compare to traditional packaging methods? - This technology offers improved reliability and performance compared to traditional methods by providing better electrical connections and thermal management. 2. What are the potential cost implications of implementing this advanced packaging technology? - While initial costs may be higher, the long-term benefits of improved device performance and reliability can outweigh the upfront investment.
Original Abstract Submitted
A semiconductor package includes a semiconductor chip including a semiconductor substrate having a first surface and a second surface opposite to the first surface, a chip pad located on the first surface and including a conductive layer, a support pad positioned on the first surface, spaced apart from the chip pad and including an insulating layer, a support bump connected to the support pad, a wiring substrate disposed to face the semiconductor substrate, a support bonding on trace (BOT) pad disposed on the wiring substrate and bonded to the support bump, and a dummy area disposed on the wiring substrate and spaced apart from the support BOT pad.
