18380345. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
WU-DER Yang of TAOYUAN CITY (TW)
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380345 titled 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
The present disclosure introduces a semiconductor package structure and a method for manufacturing it. The structure consists of a first substrate with a recess on one side, a first semiconductor die in the recess, a second semiconductor die on the opposite side of the first substrate, and a second substrate bonded to the first side of the first substrate.
- First substrate with recess for first semiconductor die
- Second semiconductor die bonded to the opposite side of the first substrate
- Second substrate electrically bonded to the first side of the first substrate
Potential Applications: - Semiconductor industry for electronic devices - Integrated circuits - Microelectronics
Problems Solved: - Efficient packaging of multiple semiconductor dies - Improved electrical connections - Enhanced performance of electronic devices
Benefits: - Compact design - Enhanced functionality - Improved reliability
Commercial Applications: - Consumer electronics - Automotive industry - Telecommunications sector
Questions about Semiconductor Package Structure: 1. How does the semiconductor package structure improve the performance of electronic devices? 2. What are the key features that make this semiconductor package structure innovative?
Frequently Updated Research: - Ongoing advancements in semiconductor packaging technology - Latest developments in integrated circuit design and manufacturing techniques
Original Abstract Submitted
The present disclosure provides a semiconductor package structure and a method of manufacturing a semiconductor package structure. The semiconductor package structure includes a first substrate having a first side and a second side opposite to the first side, wherein the first side includes a recess recessed from the first side, a first semiconductor die arranged in the recess bonded to the first side of the first substrate; a second semiconductor die bonded to the second side of the first substrate; and a second substrate electrically bonded to the first side of the first substrate.
