18380325. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
Contents
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
SHING-YIH Shih of NEW TAIPEI CITY (TW)
SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18380325 titled 'SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME
The present disclosure introduces a semiconductor device and a method for manufacturing it. The device comprises a first substrate with a front side and a back side, a first passivation layer on the front side, a second passivation layer on the back side, a conductive feature in the first passivation layer, a through substrate via penetrating both passivation layers and the substrate, and a polymer liner between the through substrate via sidewall and the substrate.
- First substrate with front and back sides
- Passivation layers on both sides of the substrate
- Conductive feature in the front passivation layer
- Through substrate via connecting both passivation layers and the substrate
- Polymer liner between the via sidewall and the substrate
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Enhanced conductivity - Improved substrate connectivity - Increased device reliability
Benefits: - Higher performance - Better signal transmission - Enhanced device durability
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Connectivity This technology can be utilized in the production of high-performance electronic devices, improving connectivity and reliability in various applications such as smartphones, computers, and automotive electronics.
Questions about the technology: 1. How does the polymer liner contribute to the overall performance of the semiconductor device?
The polymer liner helps to insulate and protect the via sidewall, enhancing the device's durability and reliability.
2. What are the potential challenges in implementing this advanced semiconductor device in mass production?
Mass production challenges may include optimizing manufacturing processes, ensuring consistent quality control, and managing costs effectively.
Original Abstract Submitted
The present disclosure provides a semiconductor device and a manufacturing method of the semiconductor device. The semiconductor device includes: a first substrate, having a front side and a back side opposite to the front side; a first passivation layer over the front side of the first substrate; a second passivation layer over the back side of the first substrate, wherein the second passivation layer has a top surface facing away from the first substrate; a conductive feature disposed in the first passivation layer; a through substrate via penetrating through the second passivation layer and the first substrate; and a polymer liner between a sidewall of the through substrate via and the first substrate.
