18379102. DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH simplified abstract (Applied Materials, Inc.)

DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH

Organization Name

Applied Materials, Inc.

Inventor(s)

RUIYING Hao of San Jose CA (US)

PAOLA De Cecco of Salinas CA (US)

MADHUR Sachan of Belmont CA (US)

KWANGDUK D. Lee of Redwood City CA (US)

MARTHA Sanchez of Menlo Park CA (US)

LUISA Bozano of Los Altos Hills CA (US)

DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18379102 titled 'DESIGN, CONTROL, AND OPTIMIZATION OF PHOTOSENSITIVITY MODULATION ALONG PHOTORESIST FILM DEPTH

Simplified Explanation

The patent application describes a method for forming a photoresist stack using different dry deposition processes for each layer.

• The method involves creating a first photoresist layer on a substrate with a specific dry deposition process.
• A second photoresist layer is then formed on top of the first layer using a different dry deposition process.

Key Features and Innovation

• Utilizes distinct dry deposition processes for each layer of the photoresist stack.
• Enables precise control over the properties and characteristics of each layer.
• Enhances the overall performance and efficiency of the photoresist stack.

Potential Applications

The technology can be applied in semiconductor manufacturing, photolithography processes, and microfabrication industries.

Problems Solved

• Improves the accuracy and quality of photoresist patterning.
• Enhances the resolution and sensitivity of imaging processes.
• Optimizes the overall performance of semiconductor devices.

Benefits

• Increased precision in photoresist layer formation.
• Enhanced control over the properties of each layer.
• Improved efficiency and performance of semiconductor manufacturing processes.

Commercial Applications

• Semiconductor fabrication industry
• Photolithography equipment manufacturers
• Microfabrication companies

Prior Art

Readers can explore prior research on dry deposition processes in semiconductor manufacturing and photolithography to understand the background of this technology.

Frequently Updated Research

Stay updated on advancements in dry deposition techniques and their applications in semiconductor manufacturing for further insights into this technology.

Questions about Photoresist Stack Formation

What are the key advantages of using different dry deposition processes for each layer in a photoresist stack?

Using different processes allows for precise control over the properties of each layer, enhancing the overall performance of the photoresist stack.

How does the method described in the patent application improve the efficiency of semiconductor manufacturing processes?

By optimizing the formation of photoresist layers, the method enhances the accuracy and quality of semiconductor devices, leading to improved efficiency in manufacturing.

Original Abstract Submitted

Embodiments disclosed herein include a method for forming a photoresist stack. In an embodiment, the method comprises forming a first photoresist layer over a substrate, where the first photoresist layer is formed with a first dry deposition process, and forming a second photoresist layer over the first photoresist layer, where the second photoresist layer is formed with a second dry deposition process that is different than the first deposition process.