18377569. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
Byeong Uk Jeon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18377569 titled 'SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Simplified Explanation: The semiconductor package described in the patent application includes a package substrate, a bridge structure, a molding member, trace patterns, via patterns, and semiconductor chips stacked on the molding member.
- The package substrate provides a base for the components of the semiconductor package.
- The bridge structure is stacked on the package substrate to support the semiconductor chips.
- The molding member surrounds the bridge structure and provides structural integrity.
- Trace patterns extend along the upper surface of the bridge structure and the molding member, facilitating electrical connections.
- Via patterns penetrate through the molding member to connect the package substrate and the trace patterns.
- The first and second semiconductor chips are stacked on the molding member and connected by the bridge structure.
Key Features and Innovation:
- Integration of trace patterns and via patterns for efficient electrical connections.
- Stacking of semiconductor chips along a specific direction for optimized layout.
- Use of bridge structure for connecting multiple semiconductor chips.
Potential Applications: The technology can be applied in various semiconductor packaging applications, including consumer electronics, automotive systems, and industrial equipment.
Problems Solved: The technology addresses the need for compact and efficient semiconductor packaging solutions with improved electrical connectivity.
Benefits:
- Enhanced electrical connections between semiconductor components.
- Compact design for space-saving in electronic devices.
- Improved reliability and performance of semiconductor packages.
Commercial Applications: The semiconductor package technology can be utilized in the production of smartphones, tablets, automotive control units, and IoT devices, offering manufacturers a reliable and efficient packaging solution.
Questions about Semiconductor Package Technology: 1. How does the trace pattern contribute to the electrical connectivity in the semiconductor package? 2. What are the advantages of stacking semiconductor chips along a specific direction in the package design?
Original Abstract Submitted
A semiconductor package including a package substrate, a bridge structure stacked on the package substrate, a first molding member surrounding a side surface of the bridge structure, a trace pattern extending along an upper surface of the bridge structure and an upper surface of the first molding member, a via pattern penetrating through the first molding member and electrically connecting the package substrate and the trace pattern to each other, and a first semiconductor chip and a second semiconductor chip each stacked on the upper surface of the first molding member and electrically connected to each other by the bridge structure. The first semiconductor chip and the second semiconductor chip are arranged along a first direction parallel to an upper surface of the package substrate and the trace pattern extends in the first direction and is electrically connected to at least one of the first semiconductor chip and the second semiconductor chip.
