18375311. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Kangha Lee of Suwon-si (KR)

Yoona Park of Suwon-si (KR)

So Eun Choi of Suwon-si (KR)

Eun Byeol Choi of Suwon-si (KR)

Chul Seung Lee of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18375311 titled 'MULTILAYER ELECTRONIC COMPONENT

Simplified Explanation

The multilayer electronic component described in the abstract includes specific electrode layers with Cu and a first additive element (Ag or Al) to prevent cracks and improve moisture resistance reliability.

• The first external electrode consists of the 1-1-th electrode layer on the third surface and the 1-2-th electrode layer on the first and second surfaces.
• The second external electrode comprises the 2-1-th electrode layer on the fourth surface and the 2-2-th electrode layer on the first and second surfaces.
• The 1-2-th and 2-2-th electrode layers have higher contents of the first additive element compared to the 1-1-th and 2-1-th electrode layers, respectively.

Potential Applications

This technology can be applied in various electronic devices and components where improved moisture resistance reliability is crucial, such as smartphones, tablets, laptops, and other consumer electronics.

Problems Solved

This innovation addresses the issue of cracks in electronic components, which can occur due to environmental factors like moisture exposure. By incorporating specific electrode layers, the technology prevents cracks and enhances the overall reliability of the component.

Benefits

The main benefits of this technology include increased durability, improved performance in challenging environments, and enhanced longevity of electronic components. Additionally, the prevention of cracks leads to higher overall reliability and stability of the devices.

Potential Commercial Applications

The technology can be utilized in the manufacturing of electronic components for a wide range of industries, including telecommunications, automotive, aerospace, and medical devices. The improved moisture resistance reliability can attract companies looking to enhance the quality and longevity of their products.

Possible Prior Art

One possible prior art could be the use of similar additive elements in electrode layers to improve the reliability of electronic components. Research and patents related to enhancing moisture resistance in electronic devices may also exist in the field.

How does this technology compare to existing methods for improving moisture resistance in electronic components?

This article does not provide a direct comparison with other methods or technologies used to enhance moisture resistance in electronic components. Further research or a comparative study would be needed to evaluate the effectiveness and efficiency of this innovation in comparison to existing methods.

What are the specific manufacturing processes involved in incorporating the electrode layers with Cu and the first additive element in the electronic component?

The abstract does not delve into the detailed manufacturing processes or techniques used to create the multilayer electronic component with the specific electrode layers. Understanding the manufacturing steps involved could provide insights into the feasibility and scalability of implementing this technology in commercial production.

Original Abstract Submitted

A multilayer electronic component, in which the first external electrode may include the 1-1-th electrode layer disposed on the third surface, and the 1-2-th electrode layer disposed on the first and second surfaces, and the second external electrode may include the 2-1-th electrode layer disposed on the fourth surface and the 2-2-th electrode layer disposed on the first and second surfaces, wherein the 1-2-th electrode layer and the 2-2-th electrode layer include Cu and a first additive element having a content lower than a content of the Cu, the contents of the first additive element included in the 1-2-th electrode layer and the 2-2-th electrode layer are greater than the contents of the first additive element included in the 1-1-th electrode layer and the 2-1-th electrode layer, respectively, and the first additive element is at least one selected from Ag and Al, thereby preventing cracks and improving moisture resistance reliability.