18374792. FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seungmin Baek of Suwon-si (KR)
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374792 titled 'FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a chip-via composite substrate with a semiconductor chip and through vias, a first redistribution wiring layer on the first surface of the substrate, and a second redistribution wiring layer on the second surface of the substrate.
- The package includes a composite substrate with a semiconductor chip and through vias.
- The first redistribution wiring layer on the first surface connects to chip pads and through vias.
- The second redistribution wiring layer on the second surface connects to the through vias.
- The through vias penetrate the substrate to provide electrical connections.
- The semiconductor chip is located in the first region of the substrate.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Improved electrical connections within semiconductor packages. - Enhanced reliability and performance of electronic devices. - Efficient signal transmission between components.
Benefits: - Higher functionality and performance of electronic devices. - Increased durability and reliability of semiconductor packages. - Cost-effective manufacturing processes for electronic components.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the consumer electronics industry to improve the performance and reliability of electronic devices. It can also benefit manufacturers by streamlining production processes and reducing costs.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the reliability of electronic devices? - This technology enhances the electrical connections within semiconductor packages, leading to increased durability and performance of electronic devices.
2. What are the potential applications of this semiconductor packaging technology? - This technology can be applied in various electronic devices, automotive electronics, medical devices, and industrial equipment to improve functionality and reliability.
Original Abstract Submitted
A semiconductor package includes: a chip-via composite substrate including a substrate, a semiconductor chip, and a plurality of through vias, wherein the substrate has a first surface and a second surface opposite to the first surface and includes a first region and a second region around the first region, wherein the semiconductor chip is provided in the first region and has chip pads and circuit patterns that are electrically connected to the chip pads, and wherein the plurality of through vias is provided in the second region and penetrate the substrate; a first redistribution wiring layer provided on the first surface of the substrate and having first redistribution wirings that are electrically connected to the chip pads and the through vias; and a second redistribution wiring layer provided on the second surface of the substrate and having second redistribution wirings that are electrically connected to the through vias.
