18374313. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
- 1 MULTILAYER ELECTRONIC COMPONENT
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Jin Hyung Lim of Suwon-si (KR)
Chul Seung Lee of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18374313 titled 'MULTILAYER ELECTRONIC COMPONENT
Simplified Explanation
The present disclosure relates to a patent application that focuses on improving the bonding force between electrode layers and a body by adjusting the growth direction of crystal grains.
- Crystal grains on the end of the dielectric layer in contact with the second electrode layers are defined as first crystal grains.
- Crystal grains on the ends of the internal electrodes in contact with the second electrode layers are defined as second crystal grains.
- The growth direction of the first and second crystal grains can be adjusted to enhance bonding force between the electrode layers and the body.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, sensors, actuators, and other devices that require strong bonding between electrode layers and the body.
Problems Solved
This technology solves the problem of weak bonding force between electrode layers and the body, which can lead to malfunctions or reduced performance of electronic devices.
Benefits
The main benefit of this technology is the improved bonding force between electrode layers and the body, leading to enhanced reliability and performance of electronic devices.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-performance capacitors for various electronic devices.
Possible Prior Art
One possible prior art could be research on crystal grain orientation and its impact on bonding force in electronic components.
Unanswered Questions
How does this technology compare to existing methods for improving bonding force in electronic devices?
This article does not provide a direct comparison to existing methods for improving bonding force in electronic devices.
What specific industries or sectors could benefit the most from this technology?
This article does not specify which industries or sectors could benefit the most from this technology.
Original Abstract Submitted
In an embodiment of the present disclosure, among a plurality of crystal grains included in first electrode layers, crystal grains disposed on an end of the dielectric layer in the second direction and in contact with the second electrode layers are defined as first crystal grains and crystal grains disposed on ends of the internal electrodes in the second direction and in contact with the second electrode layers are defined as second crystal grains, and a growth direction of the first crystal grains and a growth direction of the second crystal grains may be adjusted, so that bonding force between the first electrode layers and the body may be improved.
