18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jinhwan Jeon of Suwon-si (KR)

Kwangho Jung of Suwon-si (KR)

Chihyun Cho of Suwon-si (KR)

Sangwon Ha of Suwon-si (KR)

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18373776 titled 'CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME

Simplified Explanation

The electronic device described in the patent application includes a housing, a circuit board, a first component, a second component, a shielding mold, and an open structure.

  • The shielding mold covers the top and side surfaces of the first component on the circuit board.
  • The open structure surrounds a side surface of the second component on the circuit board, with a top portion that is opened to expose a part of the second component or the circuit board.
  • The inner surface of the open structure is spaced apart from the second component, while the outer surface contacts the shielding mold.

Potential Applications

The technology described in this patent application could be applied in various electronic devices where electromagnetic interference shielding is required, such as smartphones, tablets, laptops, and other portable electronic devices.

Problems Solved

This technology helps to reduce electromagnetic interference between components on the circuit board, improving the overall performance and reliability of the electronic device.

Benefits

- Enhanced electromagnetic interference shielding - Improved performance and reliability of electronic devices - Compact design for efficient use of space within the device

Potential Commercial Applications

"Electromagnetic Interference Shielding Technology for Electronic Devices"

Possible Prior Art

There may be prior art related to shielding molds and open structures for electromagnetic interference shielding in electronic devices. However, specific examples are not provided in this patent application.

Unanswered Questions

How does this technology compare to existing electromagnetic interference shielding methods in terms of effectiveness and cost?

This article does not provide a direct comparison with existing methods, leaving uncertainty about the advantages of this technology over traditional shielding techniques.

What are the specific electronic devices that could benefit the most from this technology, and why?

The patent application does not specify the types of electronic devices that would benefit the most from this technology, leaving room for further exploration into its potential applications in different products.


Original Abstract Submitted

An electronic device includes a housing, a circuit board disposed within the housing, a first component and a second component disposed on one surface of the circuit board, a shielding mold disposed on the one surface of the circuit board to cover top and side surfaces of the first component, and an open structure disposed on the one surface of the circuit board to surround a side surface of the second component. In the open structure, a top portion is opened and exposes a part of the second component or the circuit board, an inner surface is spaced apart from the second component, and an outer surface contacts the shielding mold.