18372870. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

MULTILAYER ELECTRONIC COMPONENT

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Yoo Jeong Lee of Suwon-si (KR)

Kwang Yeun Won of Suwon-si (KR)

Hyung Jong Choi of Suwon-si (KR)

So Jung An of Suwon-si (KR)

Jung Won Park of Suwon-si (KR)

Woo Kyung Sung of Suwon-si (KR)

Byung Jun Jeon of Suwon-si (KR)

Chul Seung Lee of Suwon-si (KR)

MULTILAYER ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18372870 titled 'MULTILAYER ELECTRONIC COMPONENT

The multilayer electronic component described in the patent application consists of a body with internal electrodes and a dielectric layer, as well as an external electrode on the body.

• The external electrode includes an electrode layer with copper (Cu), a first plating layer with nickel (Ni), and a second plating layer with nickel (Ni), with an oxide layer containing nickel (Ni) at the boundary between the first and second plating layers.
• The average thickness of the first plating layer is smaller than the average thickness of the second plating layer.

Potential Applications: - This technology can be used in various electronic devices that require multilayer components with precise electrode configurations. - It can be applied in telecommunications equipment, consumer electronics, and automotive electronics.

Problems Solved: - Provides a more efficient and reliable method for creating multilayer electronic components with improved electrode connections. - Enhances the performance and durability of electronic devices by ensuring proper electrode layering.

Benefits: - Improved electrical conductivity and signal transmission within electronic components. - Enhanced overall performance and longevity of electronic devices utilizing this technology.

Commercial Applications: Title: Advanced Multilayer Electronic Components for Enhanced Device Performance This technology can be utilized in the production of high-quality electronic devices, leading to improved functionality and reliability. The market implications include increased demand for electronic components with superior performance capabilities.

Prior Art: Further research can be conducted in the field of multilayer electronic components and electrode configurations to explore existing technologies and innovations.

Frequently Updated Research: Stay updated on advancements in multilayer electronic components, electrode materials, and plating techniques to enhance the efficiency and reliability of electronic devices.

Questions about Multilayer Electronic Components: 1. How does the thickness of the plating layers impact the performance of the electronic component? - The thickness of the plating layers affects the conductivity and durability of the component, with thinner layers potentially leading to improved performance in certain applications. 2. What are the key factors to consider when designing multilayer electronic components for specific electronic devices? - Design considerations include the material composition of the electrodes, the arrangement of internal and external electrodes, and the overall thickness of the component layers to optimize performance and reliability.

Original Abstract Submitted

A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.