18372854. LIQUID EJECTION HEAD AND RECORDING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
- 1 LIQUID EJECTION HEAD AND RECORDING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LIQUID EJECTION HEAD AND RECORDING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LIQUID EJECTION HEAD AND RECORDING APPARATUS
Organization Name
Inventor(s)
TAKAHITO Kido of Kanagawa (JP)
LIQUID EJECTION HEAD AND RECORDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18372854 titled 'LIQUID EJECTION HEAD AND RECORDING APPARATUS
Simplified Explanation
The liquid ejection head described in the patent application includes a base substrate with a flow passage for liquid, chips for ejecting the liquid, and a cover member with a sealing resin applied to the gaps between the chips and the cover member, where the gaps have non-uniform distances and are each provided with a protrusion.
- Base substrate with flow passage for liquid
- Chips for liquid ejection
- Cover member with sealing resin applied to gaps
- Non-uniform distances of gaps between chips and cover member
- Protrusions in each gap
Potential Applications
The technology could be applied in inkjet printers, 3D printers, medical devices for precise liquid dispensing, and industrial equipment for coating or cleaning processes.
Problems Solved
- Improved sealing between chips and cover member - Enhanced precision in liquid ejection - Prevention of leakage or contamination
Benefits
- Increased reliability and durability of liquid ejection head - Consistent and accurate liquid dispensing - Cost-effective manufacturing process
Potential Commercial Applications
Optimizing Liquid Ejection Heads for Enhanced Performance
Possible Prior Art
Prior art may include similar liquid ejection heads with sealing mechanisms, but the specific design of non-uniform gaps with protrusions may be unique to this patent application.
Unanswered Questions
How does this technology compare to existing liquid ejection heads in terms of efficiency and reliability?
The article does not provide a direct comparison with existing technologies in the market.
What are the potential challenges in implementing this technology on a large scale for commercial use?
The article does not address the scalability or mass production challenges that may arise when implementing this technology for commercial applications.
Original Abstract Submitted
There is used a liquid ejection head that includes: a base substrate including a flow passage of liquid formed therein; chips disposed on the base substrate and configured to eject the liquid; and a cover member disposed on the base substrate so as to surround the chips, and in which a sealing resin is applied to gaps between a plurality of the chips and the cover member, a distance of the gaps between the chips and the cover member is non-uniform, and the gaps are each provided with a protrusion.
