18371714. SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18371714 titled 'SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
The semiconductor package described in the abstract includes a first semiconductor device with a first semiconductor substrate, a first interconnect structure, and a trench that extends into the first interconnect structure and a portion of the first semiconductor substrate. Additionally, there is a second semiconductor device on top of the first semiconductor device, and a cover insulating layer that covers the first semiconductor device and a side surface of the second semiconductor device, with a portion of the cover insulating layer filling the trench and contacting the first semiconductor substrate.
- The semiconductor package features a unique design with a trench that extends into the first semiconductor substrate, allowing for improved connectivity and insulation.
- The cover insulating layer plays a crucial role in protecting the semiconductor devices and ensuring proper functioning.
- By filling the trench with the cover insulating layer, the package enhances the overall reliability and performance of the semiconductor devices.
- The integration of the second semiconductor device on top of the first one optimizes space utilization and enhances the overall functionality of the package.
- The innovative design of this semiconductor package opens up possibilities for advanced semiconductor applications and technologies.
Potential Applications: - This semiconductor package could be used in various electronic devices such as smartphones, tablets, and laptops. - It could also find applications in automotive electronics, industrial automation, and telecommunications equipment.
Problems Solved: - The semiconductor package addresses issues related to connectivity, insulation, and space optimization in semiconductor devices. - It improves the reliability and performance of the devices by providing enhanced protection and functionality.
Benefits: - Enhanced connectivity and insulation in semiconductor devices. - Improved reliability and performance. - Space optimization and increased functionality. - Potential for advanced semiconductor applications and technologies.
Commercial Applications: Title: Advanced Semiconductor Package for Enhanced Connectivity and Reliability This semiconductor package could be commercially used in the production of consumer electronics, automotive electronics, industrial automation systems, and telecommunications equipment. Its innovative design and improved functionality make it a valuable component in various electronic devices and systems.
Questions about Semiconductor Package Technology: 1. How does the trench design in the semiconductor package contribute to improved connectivity? 2. What are the potential market implications of using this advanced semiconductor package in various industries?
Original Abstract Submitted
Provided is a semiconductor package including a first semiconductor device including a first semiconductor substrate, a first interconnect structure on the first semiconductor substrate, and a trench extending into the first interconnect structure and a portion of the first semiconductor substrate, a second semiconductor device on the first semiconductor device, and a cover insulating layer on the first semiconductor device and a side surface of the second semiconductor device, the cover insulating layer including a first portion filling the trench included in the first semiconductor device and contacting the first semiconductor substrate.
