18370940. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Hongjun Lee of Suwon-si (KR)

Keunnam Kim of Suwon-si (KR)

Hui-Jung Kim of Suwon-si (KR)

Seokhan Park of Suwon-si (KR)

Kiseok Lee of Suwon-si (KR)

Moonyoung Jeong of Suwon-si (KR)

Jay-Bok Choi of Suwon-si (KR)

Hyungeun Choi of Suwon-si (KR)

Jinwoo Han of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18370940 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the patent application consists of multiple layers and structures, including lower and upper substrates, dielectric structures, memory cell structures, bonding pads, and transistors.

• The device features a memory cell structure sandwiched between the lower substrate and the lower dielectric structure.
• Both lower and upper bonding pads are integrated into the dielectric structures, with the top surface of the lower pad in contact with the bottom surface of the upper pad.
• The lower and upper bonding pads overlap the memory cell structure, enhancing connectivity and functionality within the device.

Potential Applications: This technology could be applied in the development of advanced semiconductor devices for various electronic applications, such as memory storage, data processing, and communication systems.

Problems Solved: The integration of multiple layers and structures in the semiconductor device addresses challenges related to connectivity, signal transmission, and overall performance in complex electronic systems.

Benefits: The innovative design of the semiconductor device improves efficiency, reliability, and functionality, leading to enhanced performance in electronic devices and systems.

Commercial Applications: This technology has potential commercial applications in the semiconductor industry for the production of high-performance electronic components used in consumer electronics, telecommunications, and computing devices.

Questions about the technology: 1. How does the integration of multiple layers and structures in the semiconductor device improve overall performance? 2. What specific challenges does this technology address in complex electronic systems?

Original Abstract Submitted

Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises a lower substrate, a lower dielectric structure on the lower substrate, a memory cell structure between the lower substrate and the lower dielectric structure, a lower bonding pad in the lower dielectric structure, an upper dielectric structure on the lower dielectric structure, an upper substrate on the upper dielectric structure, a transistor between the upper substrate and the upper dielectric structure, and an upper bonding pad in the upper dielectric structure. A top surface of the lower bonding pad is in contact with a bottom surface of the upper bonding pad. The lower bonding pad and the upper bonding pad overlap the memory cell structure.