18368939. SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Wooyoung Choi of Seoul (KR)

Juseong Oh of Seoul (KR)

Yoosang Hwang of Yongin-si (KR)

SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18368939 titled 'SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS

Simplified Explanation

The abstract describes a semiconductor device that includes various components such as a substrate, active regions, contacts, wiring layers, and contact plugs.

  • The device has a cell area and a peripheral circuit area, each with its own active region.
  • A direct contact is made to the first active region in the cell area.
  • A bit line structure is placed on the direct contact.
  • A capacitor structure is electrically connected to the first active region.
  • A gate structure is placed on the second active region in the peripheral circuit area.
  • Lower wiring layers are located adjacent to the gate structure and connected to the second active region.
  • Upper wiring layers are placed on top of the lower wiring layers.
  • A wiring insulating layer is positioned between the lower and upper wiring layers.
  • Upper contact plugs are connected to either the lower or upper wiring layers and extend through the wiring insulating layer.

Potential applications of this technology:

  • Semiconductor devices used in various electronic devices such as smartphones, computers, and tablets.
  • Memory devices, such as dynamic random-access memory (DRAM) or flash memory.

Problems solved by this technology:

  • Efficient integration of various components in a semiconductor device.
  • Improved electrical connections between different regions and layers.
  • Enhanced performance and functionality of the device.

Benefits of this technology:

  • Higher density and compactness of the semiconductor device.
  • Improved speed and efficiency of data transfer and processing.
  • Enhanced reliability and stability of the device.


Original Abstract Submitted

A semiconductor device includes a substrate including a cell area having a first active region and a peripheral circuit area having a second active region, a direct contact contacting the first active region in the cell area, a bit line structure disposed on the direct contact, a capacitor structure electrically connected to the first active region, a gate structure disposed on the second active region in the peripheral circuit area, lower wiring layers disposed adjacent to the gate structure and electrically connected to the second active region, upper wiring layers disposed on the lower wiring layers, a wiring insulating layer disposed between the lower wiring layers and the upper wiring layers, and upper contact plugs connected to at least one of the lower wiring layers and the upper wiring layers and extending through the wiring insulating layer.