18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368760 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a complex arrangement of redistribution wiring layers, semiconductor chips, and a heat transfer medium for efficient heat dissipation.
- First redistribution wiring layer with first redistribution wirings
- Second redistribution wiring layer with first region, second region, and second redistribution wirings
- First semiconductor chip on the first region of the second redistribution wiring layer
- Multiple second semiconductor chips spaced apart on the upper surface of the second region
- Multiple third semiconductor chips arranged in the second region between the first and second redistribution wiring layers
- Heat transfer medium on the first region overlapping the first semiconductor chip with the second redistribution wiring layer in between
Potential Applications: - Advanced electronic devices requiring efficient heat dissipation - High-performance computing systems - Aerospace and defense applications
Problems Solved: - Improved thermal management in densely packed semiconductor packages - Enhanced reliability and performance of electronic devices
Benefits: - Increased thermal efficiency - Enhanced overall system performance - Extended lifespan of electronic components
Commercial Applications: Title: Advanced Thermal Management Solutions for High-Performance Electronics This technology can be utilized in various commercial applications such as data centers, telecommunications equipment, and automotive electronics to improve thermal management and overall system performance.
Questions about the technology: 1. How does the heat transfer medium improve thermal management in the semiconductor package?
The heat transfer medium facilitates efficient heat dissipation from the semiconductor chips, preventing overheating and enhancing overall system performance.
2. What are the key advantages of using multiple semiconductor chips in the second region of the redistribution wiring layer?
By spacing out the semiconductor chips, heat dissipation is improved, and the risk of overheating is reduced.
Original Abstract Submitted
A semiconductor package includes: a first redistribution wiring layer having first redistribution wirings; a second redistribution wiring layer arranged on the first redistribution wiring layer, and including a first region, a second region, and a second redistribution wirings; a first semiconductor chip arranged on the first region of the second redistribution wiring layer; a plurality of second semiconductor chips spaced apart from each other on the upper surface of the second region of the second redistribution wiring layer; a plurality of third semiconductor chips arranged in the second region of the second redistribution wiring layer and spaced apart from each other between the first and second redistribution wiring layers; and a heat transfer medium arranged on the first region of the second redistribution wiring layer and overlapping the first semiconductor chip with the second redistribution wiring layer interposed between the first semiconductor chip and the heat transfer medium.
