18368302. Inductive Heatable Particles in Semiconductor Module (Infineon Technologies AG)
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Inductive Heatable Particles in Semiconductor Module
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Inductive Heatable Particles in Semiconductor Module
This abstract first appeared for US patent application 18368302 titled 'Inductive Heatable Particles in Semiconductor Module
Original Abstract Submitted
A method of producing a semiconductor module includes providing a power module assembly that includes a floor section, a housing that encloses an interior volume over the floor section, and a power semiconductor die mounted to a power electronics carrier within the interior volume, filling the interior volume with a potting compound, providing inductive heatable particles within the power module assembly, and inductively heating the inductive heatable particles to activate and/or accelerate a chemical reaction in the potting compound.
