18368195. 3D TAP & SCAN PORT ARCHITECTURES simplified abstract (Texas Instruments Incorporated)
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Contents
3D TAP & SCAN PORT ARCHITECTURES
Organization Name
Texas Instruments Incorporated
Inventor(s)
Lee D. Whetsel of Parker TX (US)
3D TAP & SCAN PORT ARCHITECTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18368195 titled '3D TAP & SCAN PORT ARCHITECTURES
Simplified Explanation
The abstract of this patent application describes the implementation of die test architectures in a die stack, specifically in the first, middle, and last die. These architectures are mostly the same, with a few exceptions mentioned in the disclosure.
- Die test architectures implemented in a die stack
- Specifically designed for the first, middle, and last die
- Architectures are mostly the same with a few exceptions
- Described in detail in the disclosure section of the patent application
Potential Applications
- Semiconductor manufacturing industry
- Die stacking technology
- Testing and quality control of die stacks
Problems Solved
- Standardizing die test architectures in a die stack
- Ensuring consistent testing procedures across different dies
- Addressing any exceptions or variations in the test architectures
Benefits
- Improved efficiency in die testing
- Streamlined testing procedures for die stacks
- Enhanced quality control measures for die stacks
Original Abstract Submitted
This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
