18367963. LOW STRESS THROUGH GLASS VIAS (TGVS) (Intel Corporation)
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LOW STRESS THROUGH GLASS VIAS (TGVS)
Organization Name
Inventor(s)
Mohamed R. Saber of College Station TX (US)
Manohar Konchady of Chandler AZ (US)
Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US)
Hiroki Tanaka of Gilbert AZ (US)
LOW STRESS THROUGH GLASS VIAS (TGVS)
This abstract first appeared for US patent application 18367963 titled 'LOW STRESS THROUGH GLASS VIAS (TGVS)
Original Abstract Submitted
Embodiments disclosed herein include an apparatus with a glass core and a via. In an embodiment, the apparatus comprises a layer, where the layer is a solid layer of glass. An opening is provided through the layer, and a via is in the opening. The via comprises a first material, where the first material comprises at least one metallic element, and a second material, where the second material comprises carbon.
