18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
INTEGRATED CIRCUIT DEVICE
Organization Name
Inventor(s)
TAKUYA Futatsuyama of Suwon-si (KR)
Daeseok Byeon of Suwon-si (KR)
INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18367704 titled 'INTEGRATED CIRCUIT DEVICE
Simplified Explanation
The integrated circuit (IC) device described in the patent application consists of a peripheral circuit structure and a cell array structure. The peripheral circuit structure includes a circuit substrate, a peripheral circuit, a first insulating layer covering the circuit substrate and the peripheral circuit, and a first bonding pad. The cell array structure includes an insulating structure with first and second opposing surfaces, a conductive plate on the first surface, a memory cell array on the conductive plate, a second insulating layer, a second bonding pad on the second insulating layer, first and second wiring lines on the second surface, a conductive via passing through the insulating structure connecting the conductive plate to the first wiring line, and a contact structure electrically connecting the first wiring line to the second bonding pad. The first bonding pad is in contact with the second bonding pad.
- The IC device includes a peripheral circuit structure and a cell array structure.
- The peripheral circuit structure consists of a circuit substrate, a peripheral circuit, a first insulating layer, and a first bonding pad.
- The cell array structure comprises an insulating structure, a conductive plate, a memory cell array, a second insulating layer, a second bonding pad, wiring lines, a conductive via, and a contact structure.
- The first bonding pad is in contact with the second bonding pad, connecting the peripheral circuit structure to the cell array structure.
Potential Applications
- Memory devices
- Microprocessors
- Integrated circuits for electronic devices
Problems Solved
- Efficient integration of peripheral circuits and cell arrays
- Improved electrical connections within the IC device
Benefits
- Enhanced performance of memory devices
- Increased reliability of integrated circuits
- Simplified manufacturing processes for IC devices
Original Abstract Submitted
An integrated circuit (IC) device includes a peripheral circuit structure and cell array structure. The peripheral circuit structure includes a circuit substrate, a peripheral circuit, a first insulating layer covering the circuit substrate and the peripheral circuit, and a first bonding pad. The cell array structure includes an insulating structure having first and second surfaces opposing each other, a conductive plate on the first surface, a memory cell array on the conductive plate, a second insulating layer, a second bonding pad disposed on the second insulating layer, first and second wiring lines spaced apart from each other on the second surface, a conductive via passing through the insulating structure and connecting the conductive plate to the first wiring line, and a contact structure electrically connecting the first wiring line to the second bonding pad. The first bonding pad is in contact with the second bonding pad.
