18364893. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tomohiro Iguchi of Himeji Hyogo (JP)
Tatsuya Hirakawa of Takasago Hyogo (JP)
Shogo Minami of Yokohama Kanagawa (JP)
Hiroyuki Matsuo of Nerima Tokyo (JP)
Izuru Komatsu of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18364893 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the patent application consists of an insulating substrate with metal layers, a semiconductor chip with electrodes, a bonding wire, and multiple resin layers with varying properties.
- The device includes an insulating substrate with metal layers, a semiconductor chip with electrodes, and a bonding wire connecting them.
- The resin layers cover the chip and wire, with different resins used to provide specific properties like Young's modulus and moisture permeability.
Key Features and Innovation:
- Utilizes multiple resin layers with different properties to enhance the performance and durability of the semiconductor device.
- The use of resins with varying Young's modulus and moisture permeability helps in protecting the bonding portion and preventing moisture ingress.
- The design ensures a reliable connection between the semiconductor chip and the metal layers on the substrate.
Potential Applications: The technology can be applied in various semiconductor devices requiring enhanced protection against moisture and improved bonding reliability.
Problems Solved:
- Addresses issues related to moisture ingress in semiconductor devices.
- Enhances the durability and reliability of bonding connections in such devices.
Benefits:
- Improved protection against moisture damage.
- Enhanced reliability of bonding connections.
- Extended lifespan of semiconductor devices.
Commercial Applications: Potential commercial applications include the manufacturing of electronic components, sensors, and other semiconductor devices where moisture protection and bonding reliability are critical factors.
Questions about Semiconductor Device Technology: 1. How does the use of multiple resin layers with different properties improve the performance of semiconductor devices? 2. What specific challenges does this technology address in the semiconductor industry?
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Original Abstract Submitted
A semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer; a semiconductor chip on the first metal layer having an upper electrode and a lower electrode connected to the first metal layer; a bonding wire having a first end portion connected to the upper electrode and a second end portion connected to the second metal layer; a first resin layer covering the semiconductor chip and the bonding wire, the first resin layer containing a first resin; a second resin layer covering a bonding portion between the first end portion and the upper electrode containing a second resin having a Young's modulus higher than that of the first resin; a third resin layer on the first resin layer, the third resin layer containing a third resin having a moisture permeability lower than that of the first resin.
