18364434. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Wooseup Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18364434 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation: The semiconductor package described in the patent application consists of multiple semiconductor dies stacked on top of each other, with non-conductive layers in between them. Each semiconductor die has specific layers and features that contribute to the overall structure of the package.
- The semiconductor package includes a first semiconductor die and multiple second semiconductor dies stacked on top of each other.
- Non-conductive layers are present between the first semiconductor die and the lowermost second semiconductor die, as well as between adjacent second semiconductor dies.
- Each second semiconductor die has a substrate with front and rear surfaces, interlayer dielectric layers, through electrodes, and passivation layers.
- A groove is present in the passivation layer and a portion of the substrate of each second semiconductor die.
- The second non-conductive layer is located within the groove.
Key Features and Innovation:
- Stacked structure of multiple semiconductor dies.
- Non-conductive layers for insulation.
- Specific layers and features in each semiconductor die.
- Groove in passivation layer for accommodating the second non-conductive layer.
Potential Applications:
- Semiconductor packaging in electronic devices.
- Integrated circuits.
- Microprocessors.
Problems Solved:
- Efficient stacking of semiconductor dies.
- Insulation between stacked dies.
- Enhanced structural integrity.
Benefits:
- Compact design.
- Improved performance.
- Enhanced reliability.
Commercial Applications: Potential commercial applications include the manufacturing of advanced electronic devices, such as smartphones, tablets, and computers, where compact and efficient semiconductor packaging is crucial for performance and reliability.
Prior Art: Readers interested in prior art related to this technology can explore patents and research papers in the field of semiconductor packaging, integrated circuits, and microelectronics.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies, materials, and manufacturing processes to understand the evolving landscape of this field.
Questions about Semiconductor Packaging: 1. What are the key challenges in stacking multiple semiconductor dies in a compact package? 2. How does the presence of non-conductive layers improve the performance and reliability of semiconductor packages?
Original Abstract Submitted
A semiconductor package includes a first semiconductor die, second semiconductor dies each of which has a width less than a width of the first semiconductor die and which are stacked on the first semiconductor die, a first non-conductive layer between the first semiconductor die and a lowermost second semiconductor die, and a second non-conductive layer between adjacent ones of the second semiconductor dies. Each of the second semiconductor dies includes a first substrate that has a first front surface and a first rear surface, a first interlayer dielectric layer that covers the first front surface, first through electrodes that penetrate the first substrate, and a first passivation layer that covers the first rear surface. A first groove is in the first passivation layer and a portion of the first substrate. The second non-conductive layer is within the first groove.
