18361325. ENCAPSULANT COMPOSITION AND FILM simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)

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ENCAPSULANT COMPOSITION AND FILM

Organization Name

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor(s)

Yu-Chen Kao of Zhudong Township (TW)

Meei-Yu Hsu of Hsinchu City (TW)

Chih-Hao Lin of Zhongli City (TW)

ENCAPSULANT COMPOSITION AND FILM - A simplified explanation of the abstract

This abstract first appeared for US patent application 18361325 titled 'ENCAPSULANT COMPOSITION AND FILM

The abstract describes an encapsulant composition and film, consisting of specific weight ratios of components (A), (B), and (C). Component (A) includes two compounds, while component (B) is an inorganic powder, and component (C) is an initiator.

  • The encapsulant composition contains 20-45 parts by weight of component (A) and 55-80 parts by weight of component (B), with the weight ratio of component (C) to component (A) ranging from 1:100 to 5:100.
  • Component (A) comprises first compound (A-1) and second compound (A-2), with the second compound being a monoalkenyl aromatic compound.
  • Component (B) can be either a non-modified or modified inorganic powder.
  • Component (C) acts as an initiator in the encapsulant composition.
  • The first compound (A-1) has a structure represented by Formula (I) or Formula (II).

Potential Applications: - This encapsulant composition can be used in the production of films for various industries such as electronics, packaging, and construction. - It can also be utilized in encapsulating sensitive materials for protection against environmental factors.

Problems Solved: - Provides a precise weight ratio of components for optimal encapsulation properties. - Offers a composition that can be easily applied and processed into films.

Benefits: - Enhanced protection for sensitive materials. - Improved efficiency in encapsulation processes. - Versatile applications across different industries.

Commercial Applications: - This technology can be commercialized for manufacturing companies producing films for electronic devices, food packaging, and building materials. - It can also be marketed to companies specializing in protective coatings and encapsulation solutions.

Questions about the encapsulant composition and film: 1. How does the weight ratio of components (A), (B), and (C) impact the properties of the encapsulant composition? 2. What are the specific advantages of using an initiator (component C) in the encapsulant composition?


Original Abstract Submitted

An encapsulant composition and a film are provided. The encapsulant composition includes 20-45 parts by weight of a component (A), 55-80 parts by weight of a component (B) and a component (C). The total weight of the component (A) and the component (B) is 100 parts by weight, and the weight ratio of the component (C) to the component (A) is 1:100 to 5:100. The component (A) includes first compound (A-1) and second compound (A-2), the component (B) is a non-modified inorganic powder or modified inorganic powder, and the component (C) is an initiator. The first compound (A-1) has structure represented by Formula (I) or Formula (II), and the second compound (A-2) is a monoalkenyl aromatic compound

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