18359208. ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER simplified abstract (Samsung Electronics Co., Ltd.)
Contents
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
Organization Name
Inventor(s)
Jonggeun Yoon of Suwon-si (KR)
Youngwook Kim of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359208 titled 'ELECTRONIC DEVICE INCLUDING THERMAL DIFFUSION MEMBER
Simplified Explanation
An electronic device is described in this patent application, which includes a thermal diffusion member that helps reduce hot spots. The device consists of multiple display driver integrated circuits (DDICs) that are spaced apart from each other in a non-display area of a display panel. These DDICs are oriented in a first direction from the display panel. The device also includes a circuit board that is disposed in a second direction opposite to the first direction from the display panel. The circuit board includes a timing controller IC (T-CON IC) that overlaps with at least some of the DDICs when the display panel is viewed from the first direction. A flexible circuit board is also present at one end of the display panel, which electrically connects the DDICs and the circuit board. The thermal diffusion member is positioned between the circuit board and the display panel.
- The electronic device includes a thermal diffusion member to reduce hot spots.
- Multiple DDICs are spaced apart in a non-display area of the display panel.
- The DDICs are oriented in a first direction from the display panel.
- A circuit board is disposed in a second direction opposite to the first direction.
- The circuit board includes a T-CON IC that overlaps with some of the DDICs.
- A flexible circuit board connects the DDICs and the circuit board.
- The thermal diffusion member is positioned between the circuit board and the display panel.
Potential applications of this technology:
- This technology can be used in various electronic devices with display panels, such as smartphones, tablets, and televisions.
- It can help improve the thermal management of these devices, reducing the risk of overheating and improving overall performance.
Problems solved by this technology:
- Hot spots can occur in electronic devices with display panels, leading to reduced performance and potential damage to components.
- This technology helps dissipate heat more effectively, reducing the occurrence of hot spots and improving the longevity and reliability of the device.
Benefits of this technology:
- Improved thermal management leads to better performance and reliability of electronic devices.
- Reduced hot spots minimize the risk of component failure and extend the lifespan of the device.
- Enhanced heat dissipation can also contribute to a more comfortable user experience, as the device remains cooler during operation.
Original Abstract Submitted
An electronic device including a thermal diffusion member for reducing hot spots is provided. The electronic device includes a plurality of display driver integrated circuits (DDICs) spaced apart from each other in a non-display area of a display panel, and disposed oriented in a first direction from the display panel, a circuit board disposed in a second direction opposite to the first direction from the display panel, and including a timing controller IC (T-CON IC) disposed so as to overlap at least some of the plurality of DDICs when the display panel is viewed from the first direction, a flexible circuit board disposed at one end of the display panel, and electrically connecting the plurality of DDICs and the circuit board, and a thermal diffusion member disposed, between the circuit board and the display panel.
