18359176. METHOD FOR MANUFACTURING SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING LIQUID EJECTION SUBSTRATE simplified abstract (CANON KABUSHIKI KAISHA)
METHOD FOR MANUFACTURING SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING LIQUID EJECTION SUBSTRATE
Organization Name
Inventor(s)
TETSUSHI Ishikawa of Tokyo (JP)
METHOD FOR MANUFACTURING SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING LIQUID EJECTION SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359176 titled 'METHOD FOR MANUFACTURING SUBSTRATE BONDED BODY AND METHOD FOR MANUFACTURING LIQUID EJECTION SUBSTRATE
Simplified Explanation
The method described in the patent application involves manufacturing a substrate bonded body by bonding a first substrate and a second substrate together, with each substrate forming a portion of an element. The steps involved in the method are as follows:
- Film-forming step: An inorganic film is formed on the bonding face of the first substrate, with the bonding face having a convex shape towards the second substrate.
- Contact step: The first substrate and the second substrate are brought closer and into contact with each other.
- Bonding step: The first substrate and the second substrate are bonded together using an adhesive.
Potential applications of this technology:
- Semiconductor manufacturing
- Microelectronics
- Optoelectronics
Problems solved by this technology:
- Ensuring a strong and reliable bond between substrates
- Improving the performance and durability of electronic devices
Benefits of this technology:
- Enhanced bonding strength
- Improved device performance
- Increased reliability and longevity of electronic components
Original Abstract Submitted
Provided is a method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, including: a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate; a contact step of bringing the first substrate and the second substrate closer and into contact with each other; and a bonding step of bonding the first substrate and the second substrate by an adhesive.
