18358478. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyongsoon Cho of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18358478 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a silicon substrate with through openings and a redistribution wiring layer with bonding pads, test pads, and landing pads.
- The silicon substrate has multiple through openings for communication with the redistribution wiring layer.
- The redistribution wiring layer includes bonding pads on the first surface, test pads on the first surface, and landing pads on the second surface.
- The bonding pads and landing pads are electrically connected by redistribution wires within the package.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the efficiency and reliability of electronic components in various electronic devices.
Problems Solved: - Enhances the connectivity and performance of semiconductor packages. - Facilitates the integration of complex wiring systems in compact electronic devices.
Benefits: - Improved electrical connectivity and signal transmission. - Enhanced reliability and durability of semiconductor packages. - Increased efficiency in electronic device manufacturing processes.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Connectivity This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also benefit industries involved in telecommunications, automotive electronics, and consumer electronics.
Questions about the technology: 1. How does this semiconductor package improve the performance of electronic devices? - This technology enhances electrical connectivity and signal transmission within semiconductor packages, leading to improved overall performance of electronic devices. 2. What are the potential challenges in implementing this advanced packaging technology in mass production? - Implementing this technology in mass production may require specialized equipment and processes to ensure precise assembly and reliable performance.
Original Abstract Submitted
A semiconductor package includes a silicon substrate including a plurality of through openings, and a redistribution wiring layer including a first surface and a second surface opposite the first surface, the second surface facing the silicon substrate, the redistribution wiring layer including a first pad area and a second pad area. The redistribution wiring layer includes a plurality of bonding pads on the first pad area at the first surface, a plurality of test pads on the second pad area at the first surface, a plurality of landing pads on the second pad area at the second surface, the plurality of landing pads in communication with the plurality of through openings, respectively, and a plurality of redistribution wires electrically connected to the plurality of bonding pads and the plurality of landing pads.
