18356765. HOLLOW COPPER THERMAL CONDUCTORS simplified abstract (GM Global Technology Operations LLC)

HOLLOW COPPER THERMAL CONDUCTORS

Organization Name

GM Global Technology Operations LLC

Inventor(s)

Andrew Clay Bobel of Troy MI (US)

Anil K. Sachdev of Rochester Hills MI (US)

Anthony Michael Coppola of Rochester Hills MI (US)

Sayed Youssef Sayed Nagy of Troy MI (US)

Jian Yao of Shanghai (CN)

HOLLOW COPPER THERMAL CONDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18356765 titled 'HOLLOW COPPER THERMAL CONDUCTORS

Simplified Explanation: The patent application describes a process for creating a ribbon-shaped hollow thermal conductor by forming a sacrificial material into an insert, plating it with copper, and then removing the sacrificial material to leave a hollow passage.

Key Features and Innovation:

• Formation of sacrificial material into an insert with parallel strands
• Plating the sacrificial insert with copper to create a ribbon-shaped structure
• Removal of sacrificial material to form a hollow passage through the copper thermal conductor

Potential Applications: This technology could be used in various thermal management systems, such as in electronic devices, automotive applications, and aerospace industries.

Problems Solved: This technology addresses the need for efficient thermal conductivity in a ribbon-shaped structure, allowing for better heat dissipation in confined spaces.

Benefits:

• Improved thermal conductivity
• Enhanced heat dissipation capabilities
• Space-saving design for thermal management systems

Commercial Applications: Potential commercial applications include thermal solutions for smartphones, laptops, electric vehicles, and satellites, where efficient heat dissipation is crucial for performance and longevity.

Prior Art: Readers interested in prior art related to this technology could explore patents in the field of thermal management, materials science, and heat transfer technologies.

Frequently Updated Research: Researchers in the field of thermal management and materials science may be conducting studies on improving the efficiency and design of hollow thermal conductors for various applications.

Questions about Ribbon-Shaped Hollow Thermal Conductor: 1. What are the key advantages of using a ribbon-shaped hollow thermal conductor in electronic devices? 2. How does the process of plating the sacrificial insert with copper contribute to the overall efficiency of the thermal conductor?

Original Abstract Submitted

A process for making a ribbon-shaped hollow thermal conductor includes forming a sacrificial material into an insert including a plurality of parallel strands. Plating the sacrificial insert with copper to form a ribbon-shaped structure and removing the sacrificial material from within the ribbon-shaped structure to create a hollow passage through a ribbon-shaped hollow copper thermal conductor.