18356721. SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
Organization Name
Inventor(s)
Un-Byoung Kang of Suwon-si (KR)
Sung Keun Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18356721 titled 'SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
Simplified Explanation: The semiconductor package described in the patent application includes a first redistribution layer substrate, a semiconductor chip, a coupling member, an encapsulant, and a second redistribution layer substrate. The coupling member consists of a vertical wire and a metal portion, with one end connected to the first redistribution layer substrate and the other end connected to the second redistribution layer substrate.
Key Features and Innovation:
- Semiconductor package with a unique coupling member design
- Vertical wire and metal portion configuration for the coupling member
- Electrical connections between the coupling member and redistribution layer substrates
Potential Applications: The technology can be used in various electronic devices that require efficient semiconductor packaging, such as smartphones, tablets, and computers.
Problems Solved: This technology addresses the need for reliable and compact semiconductor packaging solutions that can accommodate high-performance semiconductor chips.
Benefits:
- Improved electrical connections
- Enhanced reliability and durability
- Space-saving design for compact electronic devices
Commercial Applications: The technology can be applied in the consumer electronics industry to improve the performance and reliability of electronic devices, potentially leading to increased market competitiveness.
Prior Art: Readers can explore prior art related to semiconductor packaging technologies, vertical wire configurations, and metal portion designs in semiconductor devices.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor packaging technologies, vertical wire configurations, and metal portion designs through ongoing research and development efforts.
Questions about Semiconductor Packaging: 1. What are the key components of a semiconductor package? 2. How does the coupling member in this technology improve electrical connections in semiconductor devices?
Original Abstract Submitted
An embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribution layer substrate; a coupling member on the first redistribution layer substrate, wherein the coupling member is spaced apart from the semiconductor chip; an encapsulant on the first redistribution layer substrate, the semiconductor chip, and the coupling member; and a second redistribution layer substrate on the encapsulant, wherein the coupling member includes a vertical wire and a metal portion extending around the vertical wire, and wherein a first end of the coupling member is electrically connected to the first redistribution layer substrate, and a second end of the coupling member is electrically connected to the second redistribution layer substrate.
