18356613. HIGH-FREQUENCY CIRCUIT simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
HIGH-FREQUENCY CIRCUIT
Organization Name
Inventor(s)
Tamio Kawaguchi of Kawasaki Kanagawa (JP)
HIGH-FREQUENCY CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18356613 titled 'HIGH-FREQUENCY CIRCUIT
The abstract of this patent application describes a high-frequency circuit with specific conductive layers and members arranged in a particular configuration.
- The circuit includes a first and second conductive layer, along with multiple first and second conductive members, a third conductive member, and a fourth conductive member.
- The second conductive layer is divided into three regions, with specific side portions and angles between them.
- The direction and angles within the third region are crucial for the functionality of the circuit.
Potential Applications: This high-frequency circuit could be used in various electronic devices that require efficient signal processing and transmission, such as smartphones, radar systems, and wireless communication devices.
Problems Solved: This technology addresses the need for high-performance circuits that can handle high-frequency signals with precision and reliability.
Benefits: The circuit's unique design allows for improved signal processing, reduced interference, and enhanced overall performance in high-frequency applications.
Commercial Applications: This high-frequency circuit could be valuable in industries such as telecommunications, aerospace, and medical technology, where reliable signal processing is essential for operation.
Prior Art: Researchers interested in this technology may want to explore prior patents related to high-frequency circuits, signal processing, and conductive materials to understand the existing knowledge in this field.
Frequently Updated Research: Researchers and engineers working on high-frequency circuits may benefit from staying updated on advancements in materials science, signal processing algorithms, and miniaturization techniques to enhance the performance of such circuits.
Questions about High-Frequency Circuits: 1. What are the key challenges in designing high-frequency circuits for modern electronic devices? High-frequency circuits face challenges such as signal interference, power consumption, and heat dissipation, which can affect their performance and reliability.
2. How does the unique configuration of conductive layers and members in this circuit contribute to its high-frequency capabilities? The specific arrangement of conductive layers and members in this circuit allows for efficient signal transmission, reduced signal loss, and improved overall performance in high-frequency applications.
Original Abstract Submitted
According to one embodiment, a high-frequency circuit includes a first conductive layer, second conductive layer, a plurality of first conductive members, a plurality of second conductive members, a third conductive member, and a fourth conductive member. The second conductive layer includes a first region, a second region, and a third region between the first region and the second region. The third region includes a first side portion and a second side portion. A direction from the first side portion to the second side portion is along the third direction. A first angle between the first side portion and the second direction is different from a second angle between the second side portion and the second direction.
