18354928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Daeyoung Jung of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18354928 titled 'SEMICONDUCTOR PACKAGE
The abstract of the patent application describes a semiconductor package that includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip. Each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip, with a width smaller than that of the first semiconductor chip.
- The semiconductor package includes multiple semiconductor chips arranged in a specific configuration.
- The second semiconductor chips are positioned on the sides of the first semiconductor chip, maximizing space utilization.
- Each second semiconductor chip has an elongated shape to fit along the side of the first semiconductor chip.
- The width of the second semiconductor chips is smaller than the width of the first semiconductor chip, allowing for efficient packaging.
- This configuration optimizes the use of space and enhances the overall performance of the semiconductor package.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Efficient use of space in semiconductor packaging. - Improved performance and functionality of electronic devices. - Enhanced thermal management due to optimized chip placement.
Benefits: - Increased processing power and speed in electronic devices. - Enhanced reliability and durability of semiconductor packages. - Cost-effective manufacturing processes due to optimized chip placement.
Commercial Applications: Title: Semiconductor Package Optimization for Enhanced Performance This technology can be utilized in the consumer electronics industry to improve the efficiency and functionality of electronic devices. It can also benefit manufacturers by streamlining production processes and reducing costs.
Questions about Semiconductor Package Optimization: 1. How does the configuration of the semiconductor package contribute to space utilization and performance enhancement? 2. What are the potential drawbacks of this semiconductor packaging design, if any?
Frequently Updated Research: Researchers are constantly exploring new ways to optimize semiconductor packaging for improved performance and efficiency. Stay updated on the latest advancements in this field to ensure the competitiveness of electronic devices in the market.
Original Abstract Submitted
A semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, and a width of each of the second semiconductor chips is smaller than a width of the first semiconductor chip.
